中国集成电路设计业2015年会.docx

1、中国集成电路设计业 2015 年会暨天津集成电路产业创新发展高峰论坛CSIA-ICCAD 2015 Annual Conference &Tianjin IC Industry Innovation and Development Summit会 议 日 程Agenda2015 年 12 月 10 日，星期四December 10, Thursday, 2015地点：天津梅江会展中心一楼 N4 多功能厅Venue: Multiple-function hall N4, 1/F, Tianjin Meijiang Convention & Exhibition Center时 间Time内 容C

2、ontents开 幕 式Opening Ceremony主持人：天津市科委Moderator:08:30-08:55天津市政府领导致开幕词Address, Tianjin Municipal Government中国半导体行业协会执行副理事长徐小田先生致词Mr. Xu Xiaotian, Executive Vice General Director, CSIA国家发改委领导致词Address, NDRC科学技术部领导致词Address, MOST工业和信息化部领导致词Address, MIIT高峰论坛Top Forum主持人：中国半导体行业协会集成电路设计分会秘书长 程晋格先生Moderat

3、or: Mr. Cheng Jinge, General Secretary, CSIA-ICCAD08:55-09:25主旨报告 中国半导体行业协会集成电路设计分会理事长 魏少军教授 Prof. Wei Shaojun, General Director, CSIA-ICCAD09:25-09:55 主旨报告天津市科委09:55-10:20面向物联网、汽车电子、云计算的完整工艺平台 TSMC 中国业务发展副总经理 罗镇球先生Technology Platform for Future Applications Mr. Roger Luo, Vice President, Business D

4、evelopment, TSMC10:20-10:45“万物互联，质量为先” 物联网时代半导体企业的致胜关键 Mentor Graphics 全球副总裁，亚太区总裁 彭启煌先生“Time to Quality and Quantity” The Essence of Success in the IoT Era Danny Perng, Corp. Vice President, PacRim Managing Director, Mentor Graphics10:45-11:10面向物联网的芯片设计平台即服务（SiPaaS） 芯原股份有限公司董事长，总裁兼首席执行官 戴伟民博士Silico

5、n Platform as a Service (SiPaaS) for IoT Dr. Wayne Dai, Chairman, President and CEO, VeriSilicon Holdings Co., Ltd.11:10-11:35Cadence 在新时代助您领先一步 Cadence 公司全球副总裁，亚太区总裁 石丰瑜先生As Leader in Intelligence World with Cadence Mr. Michael Shih, Corporate Vice President, Asia Pacific Region, Cadence Design Sys

6、tems, Inc.11:35-12:00物联网：从芯片到软件的新要求 新思科技总裁兼联合首席执行官 陈志宽博士IoT: New Requirements from Silicon to Software Dr. Chi-Foon Chan, President & co-CEO, Synopsys12:00-13:25 自助午餐 Buffet Lunch主持人： 中国半导体行业协会 IC 设计分会第一副理事长 严晓浪教授Moderator: Prof. Yan Xiaolang, Chief Vice General Director, CSIA-ICCAD13:25-13:30 幸运抽奖

7、Lucky Draw13:30-13:55晶圆专工在物联网世界的角色 联华电子股份有限公司市场营销暨特殊制程研发副总经理简山傑先生I.O.T. Foundry Mr. Chien, ShanChieh, VP Of Corporate Marketing & Specialty Technology Development, UMC13:55-14:20合作共赢大数据时代 中芯国际集成电路制造有限公司全球市场部资深副总裁许天燊先生Collaborate to Win in Big Data Era Mr. Sunny Hui, Senior Vice President, Worldwide

8、Marketing, SMIC14:20-14:45芯系中国梦，共建创新生态与中国产业共成长 ARM 全球执行副总裁兼大中华区总裁 吴雄昂先生“Core” of China Dream - Grow with China and Enable Open Innovation Mr. Allen Wu, EVP and President of Greater China, ARM14:45-15:10科创引领智造 上海华力微电子有限公司市场部总监 刘子明先生Scientific and Technological Innovation Leads Intelligent Manufacturi

9、ng Mr. Henry Liu, Senior Director, Marketing, Shanghai HLMC15:10-15:25 茶歇，交流 Coffee Break15:25-15:30 幸运抽奖 Lucky Draw15:30-15:55先进制程介绍 为您所需 格罗方德半导体科技（上海）有限公司 Michael Mendicino 先生Advanced Node Technologies - Making the Right Choice Mr. Michael Mendicino, Senior Director, CMOS Platforms Business Unit,G

10、LOBALFOUNDRIES15:55-16:20新产业环境下的本土 EDA 北京华大九天软件有限公司运营副总 杨晓东先生Domestic EDA in new industry environment Mr. Steve Yang, Operation VP, Huada Empyrean Software Co., Ltd.16:20-16:45先进封装助力智能硬件发展 苏州晶方半导体科技股份有限公司副总经理 刘宏钧先生Advanced packaging to give you better vision, sense and security Mr. Russell Liu, VP,

11、China Wafer Level CSP Co., Ltd.16:45-17:10搭载“中国制造 2025”，打造领先的汽车“中国芯” 大唐恩智浦半导体有限公司首席执行官，总经理 张鹏岗先生Conform to Made in China 2025 to build into worlds leading automotive semiconductor company Mr. Paul Zhang, CEO, Datang NXP Semiconductors Co., Ltd.17:10-17:35集成电路设计产业并购整合讨论 飞思卡尔强芯（天津）集成电路设计有限公司总经理 仇雨菁女士I

12、C Design Industry Merger & Integration Discussion Maggie Qiu, General Manager, Freescale Qiangxin (Tianjin) IC Design Co., Ltd.17:35-17:40 幸运抽奖 Lucky Draw18:30-20:30欢迎晚宴（北京华大九天软件有限公司赞助）Welcome Dinner Banquet (Sponsored by Empyrean)地点：万丽天津宾馆大宴会厅Site: Renaissance Tianjin Lakeview Hotel2015 年 12 月 11 日

13、，星期五Dec 11, Friday, 2015专题论坛（一）Subject Forum ()地点：天津梅江会展中心二楼 213 会议室Venue: Meeting Room 213, 2/F, Tianjin Meijiang Convention & Exhibition Center时 间Time内 容Contents演讲人LecturerEDA、IP 与 IC 设计服务EDA, IP and IC Design Service主持人：中国半导体行业协会集成电路设计分会副理事长，周生明先生Moderator: Mr. Zhou Shengming, Vice General Direct

14、or, CSIA-ICCAD08:40-09:05新一代光通信前端智能化光收发集成电路系列的发展The Development on New generation of Optical Transceiver ASIC厦门优迅高速芯片有限公司首席科学家，黄以明Huang Yiming, Chief Scientist, XIAMEN UX HIGH-SPEED IC CO., LTD09:05-09:30 新思科技公司 09:30-09:55迎接 16nm 时代 SoC 时钟、时序和功耗挑战The Clock, Timing and Power Optimization Solutions a

15、t the 16nm node北京华大九天软件有限公司物理设计事业部经理，董森华Senhua, Dong, Department Manager, Physical Design BU, Huada Empyrean Software Co., Ltd.09:55-10:20企业级硬件仿真平台 Palldium Z1 带来下一代数据中心级仿真解决方案New Era of Datacenter-class Emulation with Palladium Z1 Enterprise Emulation PlatformCadence 公司亚太区系统解决方案暨验证平台总监，张永专Simon Cha

16、n, Director of System Solution and Verification Platform, Asia Pacific, Cadence10:20-10:45FD-SOI 适用于物联网的低功耗技术FD-SOI Low Energy Technology for IoT芯原微电子（上海）有限公司基础 IP 及版图设计资深总监，金小卫Shirley Jin, Sr. Director, Foundation IP and Layout, VeriSilicon Microelectronics (Shanghai) Co., Ltd.10:45-11:10从现实到虚拟，和 V

17、eloce 一起改变你的验证流程Real 2 Virtual, go with Veloce change your verification flowMentor Graphics 仿真部门技术经理，张俊Justin Zhang, Technical Manager, Emulation Division, Mentor Graphics11:10-11:35仿真驱动智能物联网产品设计Simulation Driven smart Internet of Things (IoT) Product DevelopmentANSYS 公司主任应用工程师，赵常Zhao Chang, Lead Ap

18、plication Engineer, ANSYS Inc.11:35-12:00先进存储器设计的高精度电路仿真和验证High accurate circuit verification and signoff for advanced memory designs概伦电子科技有限公司市场副总裁，杨廉峰Lianfeng Yang, Marketing VP, ProPlus Design Solutions, Inc.12:00-12:05 幸运抽奖 Lucky Draw12:05-13:00 自助午餐 Buffet Lunch主持人：中国半导体行业协会集成电路设计分会副理事长，张力天先生Mo

19、derator: Mr. Zhang Litian, Vice General Director, CSIA-ICCAD13:00-13:25从工艺建模、设计仿真到电路测试 是德科技提供 IC 全面解决方案From Modeling, simulation to test - Full IC solution from Keysight是德科技（中国）有限公司大中华区市场部经理，任彦楠Ren Yannan, Marketing development manager, Keysight Technologies13:25-13:50壹晶半导体设计和制造服务eSilicon Semiconduc

20、tor Design & Manufacturing Solutions壹晶半导体资深客户市场经理，罗志华Elwin Luo, Sr. Client Marketing Manager, eSilicon13:50-14:15面向物联网（IOT）应用的高能效嵌入式 CPUPower efficient embedded processor for IoT applications杭州中天微系统有限公司首席技术官，孟建熠Meng Jianyi, CTO, C-SKY Microsystems CO.,LTD14:15-14:30 茶歇，交流 Coffee Break14:30-14:55物联网时

21、代的智能硬件The Smart hardware in Internet of things中国科学院 EDA 中心主任，陈岚Chen Lan, Director, EDA Center of Chinese Academy of Sciences14:55-15:20Robei 可视化芯片设计软件和自适应芯片Robei Visual Chip Design Software and Adaptive Chip青岛若贝电子有限公司总裁，吴国盛Wu Guosheng, CEO, Robei LLC15:20-15:50未来物联网创新平台解决方案Innovation Platform Soluti

22、on for the Future IoT灿芯半导体（上海）有限公司首席技术官，庄志青John Zhuang, CTO, Brite Semiconductor (Shanghai) Corporation15:50-16:15定制您自己的“芯”Custom Build Your Chips北京芯诣世纪科技有限公司销售总监，李伟Andrew Li, Sales Director, Beijing StarChip Technologies, Inc.16:15-16:40 快速实现系统开发的基带芯片设计套件Baseband IC Design Kits for Rapid System Rea

23、lization展讯通信（上海）有限公司硬件部高级副总裁，罗强John Rowland, SVP of Hardware Engineering, Spreadtrum 16:40-16:45 幸运抽奖 Lucky Draw18:00-20:00闭幕招待晚宴Closing Reception Banquet地点：天津赛象酒店Site: Tianjin Saixiang Hotel2015 年 12 月 11 日，星期五Dec 11, Friday, 2015专题论坛（二）Subject Forum ()地点：天津梅江会展中心二楼 214 会议室Venue: Meeting Room 214,

24、2/F, Tianjin Meijiang Convention & Exhibition Center时 间Time内 容Contents演讲人LecturerIP 与 IC 设计IP and IC Design主持人：中国半导体行业协会集成电路设计分会副理事长，高松涛先生Moderator: Mr. Gao Songtao, Vice General Director, CSIA-ICCAD08:40-09:05物联网应用：可靠、信赖与安全的内嵌式NVM 解决方案Trustworthy Logic NVM Solutions for Various IoT Applications力旺电子

25、营销副处长，郭东政Steve Kuo, Marketing Deputy Director, eMemory09:05-09:30视频编解码发展趋势Video Codec Trend芯媒半导体（上海）有限公司中国区销售总经理，王田Wang Tian, China Country Manager, Chips&Media, Inc.09:30-09:55Arteris NoC Adoption in Automotive and IoT美国安通思控股有限公司技术支持，曾品翰William Tseng, Solutions Architect, Arteris Inc.09:55-10:20IC

26、技术创新实现智能生活IC Innovations Enable New Smart Life安谋电子科技（上海）有限公司中国区 FAE总监，刘澍William Liu, FAE Director, ARM China10:20-10:45高速接口及超低功耗 IP 应用解决方案The High Speed Interface and ULP IP Solutions北京华大九天软件有限公司 IP 与设计服务事业部总监，刘寅Liu Yin, Senior Director, IP & Design Service BU, Huada Empyrean Software Co., Ltd.10:45

27、-11:10如何在 28/14 纳米工艺上轻松集成芯动高速接口 IPSmooth Integration of Innosilicon Interface IP at 28/14nm芯动科技有限公司CEO，敖海Gordon Ao, CEO, Innosilicon Technology Ltd.11:10-11:35物联网的低功耗设计挑战Low Power Challenges of IoT创意电子股份有限公司资深副总经理，梁景哲CJ Lian, R&D Senior Vice President, GUC11:35-12:00嵌入晶心核，万物皆联网Embedding Andes, Conne

28、cting Everything晶心科技股份有限公司部经理，谢幼龄Amanda Hsieh, Deputy Manager, Andes Technology Corporation12:00-12:05 幸运抽奖 Lucky Draw12:05-13:00 自助午餐 Buffet Lunch主持人：中国半导体行业协会集成电路设计分会副秘书长，王志华教授Moderator: Prof. Wang Zhihua, Vice General Secretary, CSIA-ICCAD13:00-13:25M31 物联网硅智财解决方案Ultra-Low Power IP Solutions for

29、IoT円星科技副总经理，石维强Willis Shih, Vice President, M31 Technology13:25-13:50从 IoT 到网通应用，智原经验与方案，加速您的产品问世From IoT to Networking, Faraday Experience and Solutions Enable Your Fast Time to Market智原科技股份有限公司业务行销副总经理，于德洵Remi Yu, Vice president of Business and Marketing, Faraday Technology Corporation13:50-14:15I

30、magination IP 助力下一波创新New thinking for the next wave of innovation进想科技（上海）有限公司中国销售总监，温宵恺Walter Wen, China Sales Director, Imagination Technologies14:15-14:30 茶歇，交流 Coffee Break14:30-14:55在晶圆代工业内领先的嵌入式闪存方案Leading edge embedded flash solution in foundry industry常忆科技股份有限公司资深协理，林志光JK Lin, Senior Directo,

31、 Chingis Technology Corporation14:55-15:20射频模拟无源系统芯片化技术 IPDChip Level Integrated Passive System Design - IPD苏州芯禾电子科技有限公司创始人、工程副总裁，代文亮Dai Wenliang, Founder & VP Engineering, Xpeedic Technology15:20-15:50物联网时代系统芯片的设计需求Design needs of SoC in IoT无锡华大国奇科技有限公司总裁，谷建余Jianyu Gu, President, Qualchip Technolog

32、ies, Inc.15:50-16:15 智能互联世界的 IP 解决方案IP solutions for connected smart world美国思华科技有限公司高级技术支持经理，陈昊Chen Hao, Sr. FAE Manager, CEVA16:15-16:40低功耗小面积的 16/32 位处理器助力物联网应用Choosing the Right CPU Core for IoT and Wearable Sensor Nodes宏太科技股份有限公司业务经理，黄孝衡Norman, Sales Manager, Avant Technology Inc.16:40-17:05Power Management in IoTKilopass Technology市场战略总监，居礼Lee Chu, VP of Strategic Accounts,Kilopass Technology