1、芯片封装方式大全BGABall Grid ArrayEBGA 680LLBGA 160LPBGA 217LPlastic Ball Grid ArraySBGA 192LTSBGA 680LCLCCQFPQuad Flat PackageTQFP 100LSBGASC-70 5LSDIPSIPSingle Inline PackageSOSmall Outline PackageSOJ 32LCNRCommunication and Networking Riser Specification Revision 1.2 CPGACeramic Pin Grid ArrayDIPDual Inl
2、inePackage DIP-tabDual InlinePackage withMetal HeatsinkFBGAFDIPFTO220SOJSOP EIAJ TYPE II 14LSOT220SSOP 16L SSOPTO18TO220TO247Flat PackHSOP28ITO220ITO3pJLCCLCCLDCCLGATO264TO3TO5TO52TO71TO72TO78LQFPPCDIPPGAPlastic Pin Grid Array PLCCPQFPPSDIPLQFP 100L TO8TO92TO93TO99TSOPThin Small Outline PackageTSSOP
3、 or TSOP IIThin Shrink Outline PackageuBGAMicro Ball Grid ArrayuBGAMicro Ball Grid ArrayMETAL QUAD 100L PQFP 100L QFPQuad FlatPackageSOT220SOT223SOT223SOT23SOT23/SOT323ZIPZig-Zag InlinePackageTEPBGA 288L TEPBGA C-Bend Lead CERQUADCeramic Quad Flat PackCeramic CaseLAMINATE CSP 112LChip Scale Package
4、Gull Wing Leads LLP 8La PCI 32bit 5VSOT25/SOT353SOT26/SOT363SOT343SOT523SOT89SOT89Socket 603FosterLAMINATE TCSP 20LChip Scale PackagePeripheral Component Interconnect PCI 64bit 3.3VPCMCIAPDIPPLCC SIMM30Single In-line Memory ModuleSIMM72Single In-line Memory ModuleSIMM72Single In-line SLOT 1For intel
5、 Pentium II Pentium III & Celeron CPUTO252TO263/TO268SO DIMMSmall OutlineDual In-lineMemory ModuleSOCKET 370For intel 370 pin PGA Pentium III & Celeron CPUSOCKET 423For intel 423 pin PGA Pentium 4 CPUSOCKET 462/SOCKET AFor PGA AMD Athlon & Duron CPUSLOT AFor AMD Athlon CPUSNAPTKSNAPTKSNAPZPSOHSOCKET 7For intel Pentium & MMX Pentium CPU各种封 装 缩 写 说 明BGABQFP132BGABGA BGABGA BGA CLCCCNRPGADIPDIP-tabBGA