电子英语证书考试(PEC)-半导体词汇汇总.doc

1、电子英语证书考试(PEC)- 半导体词汇汇总1 号极限开关 LS1(limit suitch 1)232 bus 的使用寿命已到或线路短路或断路 232 bus error488 bus 的使用寿命已到或线路短路或断路 488bus error5S(整理、整顿、清扫、清洁、修养) 5S（Seiri-Seiton-Seiso-Seiketsu-Shitsuke)5u 之 pp 质滤心 cartridge p.p 5uABC 分类法 ABC classificationAUTO 模 automatic molding systemA 板 A plateBT 指示剂 eriochrome black

2、 t indicatorB 板 B plateCO2 气泡机 CO2 bubblerDIP 产品上的裂角任何一方向大于 1.25mm 且另一方向亦大于 0.5mm 拒收Any device having a chip out greater than 0.5mm in width (or depth) and 1.25mm in length is rejectable.DIP 从胶体末端算起,支持棒突出部分不得大于0.25mm(SOP 为 0.15mm)。The product is rejectable when pad support protrudes more than 0.25mm

3、 from the end of the package body.(sop:0.15mm).DIP：不符合脚量规之脚弯拒收。 Any device showing bent leads (in case of doubts use the applicable gauge) is rejectable.DIP：不均匀的镀层表面，使得小脚厚度大于0.4mm 或宽度大于 0.5mm 或大脚以上厚度大于0.75mm，拒收。Non-uniform solder such that a lead exceeds the dimensions of 0.4mm thick and 0.5mm wide

4、below the seating plate, or an overall thickness of 0.75mm above the seating plane is rejectable.DIP：从脚尖端到肩膀弯脚处，脚的镀层表面须均匀且连续。Lead finish on the leads shall be smooth and continuous from lead tip up to and over bend of lead.DIP：顶出孔不得高于胶体面或低于胶体表面0.5mm。Ejector marks more than above the surface or more

5、than 0.5mm below the surface of the device is rejectable.DIP：离胶体 0.5mm 以外之脚表面有浮起、剥落或鳞片状等现象拒收。Lifting, peeling or flaking of the lead finish is rejectable excluding 0.5mm from the body.DIP：小脚上不得有任何外来物造成之沾污。大脚上不得有大于 0.15mm 直径圆面积之沾污。Package leads shall be free from attached foreign material except for

6、foreign material located above the seating plane of the lead, not bigger than 0.15mm in diameter.DIP：由于冲切造成之支持棒残存凸出或大脚凹陷大于 0.25mm 拒收。Any lead with dam bar step dimensions exceeding 0.25mm is rejectable.Driver board 的使用寿命已到或线路短路或断路 driver board errorEDTA-2NA 标准溶液 EDTA-2NA standard solutionEprom 的使用寿命

7、已到或线路短路或断路 eprom errorKBS 94 混床树脂筒 leasing mix bed resin bottle, kbs 94L/F 存放架 stack loaderL/F 放反将导致反弯脚。 Lead frame reverse will cause reverse bending.L/F 排放机 Lead Frame Auto Loader MachineL/F 用剥锡剂 TLS-85a solde stipper for plastic package,TLS-85aL/F 用剥锡剂 TLS-85b solde stipper for plastic package, T

8、LS-85bL/F 用剥锡剂 TLS-86 solder stipper for plastic package,TLS-86L 形尾塞 end plug (L)L 型尾塞 end plug(L)MPU 的使用寿命已到或线路短路或断路 MPU errorN2 流量 nitrogen gas flow rateOC 曲线 poprtation curveP.P 打包袋 P.P BandPDCA 管理循环 PDCA（ Plan-Do-Check-Action)PIN1 标示 PIN1 identificationPIN1 标示要有且与规格所订的尺寸一致。 The PIN1 identificati

9、on must be present and in accordance with the specified dimensions.PP 材质阳极袋 anode bag p.p.QA 允收章 QA markQFP 用的塑胶承载盘 QFP plastic trayRAM 的使用寿命已到或线路短路或断路 RAM read/write error 即 RAM errorSOP：不均匀的镀层表面，使得脚的宽度大于0.5mm 或脚厚度大于 0.25mm。Non-uniform lead finish such that a lead exceeds the specified dimensions 0

10、.5mm or leadl thickness exceeds 0.25mm is rejectable.SOP：产品边缘上的裂角宽或深大于 0.2mm，长大于 0.6mm 或露出体材料拒收。Any devices having a chip out greater than 0.2mm width(or depth) and 0.6mm in length or exposed lead frame material is rejectable.SOP：顶出孔低于胶体表面 0.2mm，或是高于胶体表面拒收。Ejector marks more than above the surface o

11、r more than 0.2mm below the surface of the device is rejectable.SOP：脚浮不得超过 0.1mm。 Lead coplanarity shall be within 0.1mm of one another in the vertical direction.SOP：脚上不得有任何外务物之沾污，但如果是废胶则不能大于 50脚宽为直径的圆面积。Leads shall be free attached foreign material, flash shall not exceed 50% of the lead surface.SO

12、P：离胶体 0.2mm 以外之脚表面有浮起、剥落或鳞片状等现象拒收。Lifting, peeling or flaking of the lead finish is rejectable excluding 0.2mm of the lead length from body.SOP：由于冲切造成之支持棒残存凸出或凹陷大于 0.1mm 时拒收。Any lead with dam bar step dimensions exceeding 0.1mm is rejectable.S 形尾塞 end plug (S)XX 部门经理 manager of XX departmentXX 电子有限公

13、司 XX Electronics CO.LtdX 管率 X-ray yieldX 射线 X-rayX-射线检验 X-ray inspection安全光幕 safety curtain安全库存量 safety stock安全眼镜 safety glasses氨水 ammoniam water按下紧急按钮。 Press the emergency button.按需订货 lot for lot昂球 lifted bond昂楔 lifted wedge凹模 cavity plate,cavity block百万分之一 PPM (parts per million)柏拉图 Pareto chart板状

14、模组模具 plate mold半导体 semiconductor半球 insufficient ball size半自动框架输送机 off loader包反 wrong orentation molding包反 wrong orientation molding包封 molding包封 molding 包封模具 mold chase包封模具 mold chase包封偏差 molding mismatch包装 packing包装 packing 包装盒(内箱) packing box包装盒缺点 packing defect criteria包装外箱 shipping box保管费 carryin

15、g cost保管费率 carrying cost rate保险期 safety time保压时间 holdup time保质期 shelf life报废 scrap备注 remark背金/银 backside metal (Au/Ag)背面 back side背面打印 back marking崩角 chip package崩碎 chips比重 specific gravity比重 specific gravity比重计 hydrometer闭环物料需求计划 closed loop MRP闭模时间 closing time边筋翘起 bending side rail边晶 edge die边晶 r

16、eject die around slice edge边框 side rail边沿芯片 edge die编带 Tape & Reel编带 tape/real编带拉力测试 peel back force test编织层 braid扁平电缆 flat cable,ribbon cable扁球 flat ball变差 variation变色 discoloration变色（发黄，发黑，发花，水渍，酸斑） discolor(yellowish,blcken,water mark)变色、氧化、浮起 discoloration/oxidation/lifting变形 deformed变形 deformed

17、/distort标杆瞄准 benchmarking标签 label标签、封装、QA 允收章 defect criteria labelled boxes/seal/QA mark标签内容错误 wrong contents on label标签内容与内盒产品不符合 contents of label do not correspond with contents of box标签位置不对、标签贴反 wrong location/orientation of label标准 criteria标准操作程序（作业指导书） SOP（Standard Operating Procedure）标准产品成本

18、standard product cost标准单位运转工时 standard unit run hour标准工资率 standard wage rate标准机器设置工时 standard set up hour表面安装 surface mounting表面粗糙 dull finish / rough surface表面贴装式 surface mount technology(SMT)表面污染 surface contamination别忘了在不良产品上作记号 Dont forget to mark at NG products.冰箱 refrigerator冰柱状 icicle丙酮 aceto

19、ne饼夹 Pellet Tong波峰焊 wave soldering玻璃棒 glass rod玻璃转换温度 grass transition temperature薄膜气泡 tape bubbles薄片，锯齿状 flake补焊 rebonding补零 remanence fill补足欠交 fill backorder不得有任何金属层腐蚀 ny metallization corrosion is rejectable不合格 ninconformity不合格品 ninconformance不活动报告 no action report不良品 reject unit (RJ)不良数管制图 P N c

20、hart不相同盖印 different marking不粘 Non-Stick不正确的周期码 incorrect date code布线错误 wrong bonding布线图 bond diagram步进夹子 index cliper步骤 process/step部分盖印 partial marking擦痕 scratches擦伤 scratches擦锡 solder scrape材料 material材料清单 BOM（bill of material）财务部 financial department(FD)采购订单跟踪 purchase order tracking采购订单价格 price

21、purchase order采购计划法 vendor scheduling采购计划员 vendor scheduler采购员 buyer参数 parameter残料率 scrap factor残渣、废屑 residues仓库库位类型 inventoty location type仓位备注 location remarks仓位代码 location code仓位数量 quantity at location仓位状况 location status操作规程（操作说明书/操作手册） operation manual操作员 operator测镀 sputtering测浇口 edge gate测克 pu

22、ll test测克拉力 pull test测克拉力机 pull meter测克异常报告书 abnormal report of pull test测力计 force gauge测量 measurement测量内容 measure item测量系统分析 MSA measure system analysis测试 test测试机诊断 test diagnostic层 level层流台 lamina flow插孔 socket contact查找和确认根本原因 Define & Verify Root Cause差色剂 colorant产量 through put产品 product产品（封装体）

23、package产品长度 packqge length产品结构树 production tree产品控制 product control产品宽度 package width产品率 production rate产品设计 package design产品特殊特性 special product characteristic产品外形测量 measure for package out-line产品线 production line产品在管中 products in tubes产品在管中方向错误 wrong orientation of products in tube产品质量先期策划和控制计划 AP

24、QP advanced product quality planning and control plan厂际需求 interplant demand超波膜 UV tape超薄型四周平面式封装 IC TQFP thin quad flat pack超薄型缩小式海鸥翅膀型封装 IC TSOP thin small outline package超期待烘产品烘烤及生产纪录 dry for overdue prduct of wait for molding and production record超声波焊接 ultrasonic welding超声波清洗机 ultrasonic clearing

25、 machine超音波功率 bond power超音波清洗 F/S finesonic clean车床 engine lathc车间作业管理 shop floor control尘粒 particle 尘粒计数器 particle counter尘流台 laminar flow沉淀物 precip itate成份 composition成型 forming成型角度 foot angle承载架 carrier承载架剥锡剂 BS-89 belt stripper,bs-89程序 procedures尺寸控制计划（动态控制计划） DCP dimension control plan(dynamic

26、control plan)齿条 anti bar充压 air compressed冲床 punch machine冲杆头 plunger tip冲杆压强 transfer pressure冲胶 D/J冲胶杆 plunger 冲胶劲 transfer pressure冲胶时间 transfer time冲胶式 transfer type冲胶套筒 pot冲胶压力 transfer pressure冲切，成型模具 dieset冲切不对称 dam bar dimension冲塑 degate/dejunk冲塑切中筋 dejunk trim冲弯率 wire deflection rate冲压车间 sta

27、mp workshop,press workshop冲压模具 die冲压速度 injection setting冲圆 fan out抽样 sampling抽样计划 sampling plan抽样数 sample size抽样数 SS（Sample Size）出货 shipping出货 shipping出货标签 shipping label出货标签 shipping label出货品管 OQC（Out-going Quality Control)初始过程能力 preliminary process capability除非共同的接点，否则焊线与焊线不可相交 Broken wire is rejc

28、table.储存干燥箱 store dry box传统摸（单缸模） conventional mold die传位不良 index error吹气位 blow position吹气延时 high pressure blow time纯水 deionized water (DI water)纯铜散热片 Copper Heat Sink次品率 yield lost次要缺点 minor defect次要缺陷 minor failure粗糙面 rough surface粗能力计划 rough-cut capacity planning催化剂 curing agent存储干燥箱 store dry bo

29、x措施信息 action message错方向 wrong orientation错模 offset错模 offset mold错位 molding mismatch错字 wrong marking达到库存 available stock打凹 down set打包带太松 P.P Band too loosen打包机 packing machine打不粘 Non-stick打次 defect打火棒 E.F.O.touch打线速度 bonding speed打线图 bond diagram打印 marking打印 marking打印不良 illegible marking打印偏移 marking

30、off-center打印字间距 mark character distance大脚上镀不全面积大于小脚宽为为直径之圆面积，拒收Non-wetting above seating planelead width is rejectable.呆滞材料分析 excess material analysis待检验产品 waiting for inspection戴粉红色帽子的人就是领班 The foreman is the person who wears the pink hat.单列直插式 single side lead insert单面板 single sided board单腔模具 sing

31、le cavity mould单位成本 unit cost单元式制造 cellular manufacturing单值 individual弹坑 crater弹匣 cassette/magazine弹匣组 cassette set弹性强度 flexural strength弹性系数 flexural modulus氮气 N2 /nitrogen氮气柜 N2 cabinet当一个产品其正面及反面分别表示不同类型时拒收。When a device has top and bottom marking indicating different product type, it is rejectab

32、le.刀痕毛刺 kerf chipping刀片 punch刀片 punch导电袋 conductive bag导电地垫 conductive floormat导电管 conductive tube导电海绵 conductive sponge导电胶 epoxy导电胶 epoxy导电胶不足 insufficient epoxy导电胶不足 insufficient epoxy导电胶裂缝 epoxy crack导电胶气孔 epoxy void导电性 conductive导电桌垫 conductive table mat导轨（流道） workholder导套 bushing导线 wire导柱 guide

33、 pin导柱 post导柱（标杆） post倒冲法 back flush倒角 chamfer / touch up倒序计划 back scheduling倒装芯片 FC（Flip Chip ）倒装芯片 flip chip登陆标志 MPS book flag MPS低位码 low level code低应力添加剂 low stree additive滴定分析 titration analysis底针板 ejector plate地板 building floor第 1 脚记号 pin 1 dot第二点球焊功率 2nd bond power第二点球焊时间 2nd bond time第二点球焊压力

34、2nd bond force第二点脱落 second bond peel off第一点球焊功率 1st bond power第一点球焊时间 1st bond time第一点球焊压力 1st bond force第一点虚焊 1st bond non-stick第一只脚 pin 1 indicator点焊不完全在焊接脚的焊接区内（点斜边） Bonds on thepackage post that are not completely within the boundaries of the package post is rejectable.点焊尺寸（第二点焊球尺寸） Tailless bon

35、ds on the die or package post that are less than 1.2 times or greater than 5.0 times the wires the wire diameter inwidth or are less than 0.5 times or greater 3.0 times the wire diameter inlength is rejectable.点火器 spark gun点浇口 pin-point gate点胶 die coating点胶步骤 procedure for chip coating点胶机 chip coating machine点胶缺点 chip coating defect点胶污染 Dimensions contamination.点胶一般缺点 Chip coating general defect.点脱 lift stitch