ARLONSecure1500FG导热粘接绝缘膜应用介绍.ppt

1、ARLON Secure 1500FG导热粘接绝缘膜应用介绍Application of ARLON Secure 1500FG Thermal Insulator,深圳市艾为创科技有限公司Shenzhen Aiweichuang Technology Co.,Ltd.-AVC-,内容Contents,ARLON公司简介ARLON company profileSecure 1500FG材料特性Characteristics of Secure 1500FGSecure 1500FG材料技术演进Technology evolution of Secure 1500FGSecure 1500FG

2、材料应用工艺简介Application process of Sucure 1500FG同其它功率器件安装方式对比Comparisons of mounting method between Secure 1500FG and other power devices优选应用工艺条件Preferable conditions of application processQ&AQ&A,ARLON公司简介Arlon Company Profile,ARLON是一家专业生产高端电子材料的美国公司，母公司Handy&Harmen是纽约股市上市公司。 Arlon is an American manufa

3、cturer of high-end electronic materials,whose parent company,Handy&Harman is a NY stocks public company.ARLON MED 高性能PCB材料：导热PP、高频板材（聚四氟乙烯）、高可靠性板材（聚酰亚胺） High performance PCB materials:thermally conductive PP,high frequency plates(polyfluortetraethylene) and high reliability plates(polyimide)ARLON ST

4、D 自从 1954 年以来就是硅橡胶和硅酮胶技术的领先者。硅橡胶是一种独特的合成橡胶，在低温和高温环境中具有高性能的电绝缘。 ARLON STD长期关注精密压延硅橡胶涂层布块,以及挤压硅橡胶带专业研究。 通过在硅橡胶领域内独一无二的专门研究，培养出了无与伦比的技术胜任能力。 Arlon 追求最严格的质量标准与控制。 在整个生产过程中结合了统计过程控制方法，以确保压延准确度和精确度。 激光测量性能确保了适合全部制造过程的整个辊筒工作面长度压延厚度的精确控制 。 自愈合有机硅绝缘胶带； 导热粘接绝缘膜；,ARLON公司简介Arlon Company Profile,ARLON STD Arlon-

5、STD has been a leader in silicone rubber and silicone adhesive technologies since 1954. Silicone rubber is a unique elastomer that delivers high performance electrical insulation in low temperature and high temperature environments. Arlon focuses on precision-calendered silicone rubber coated fabric

6、 sheets and specialty extruded silicone rubber tapes. By specializing exclusively in silicone,Arlon has developed unmatched technical competence.Arlon pursues the most rigorous quality standards and controls.They have incorporated statistical process control methods throughout our manufacturing oper

7、ations to assure calendering accuracy and precision. Laser measurement capability ensures precise control of calendered thickness across the roll width for the entire production run. Self-bonding organic silicon insulative tape; Thermal insulator adhesive;,Secure 1500FG材料特性Characteristics of Secure

8、1500FG,材料基本特性Basic characteristics of the material 1. 专门针对电源产品功率器件的安装需求而开发，集导热、绝缘、粘接固定等功能于一 身； Secure 1500FG is intended for power devices with its multifunction of heat conducting,insulating and bonding; 2. 基体材料为添加了导热填料的高性能有机硅橡胶。有机硅材料优异的 高、低温特性，良好的弹性确保了-40到200的工作温度范围，并 能承受苛刻的高低温冲击条件； The basic mate

9、rial is organic silicon rubber with heat conductive aditive.Its hot and cold properties and high elasticity ensure its working capability under-40150 and thermal shock resistance;,Secure 1500FG材料特性Characteristics of Secure 1500FG,3. 特殊的加热固化机理确保良好的粘接强度； Unique thermal enhancing mechanism ensures high

10、 cohesional strength;4. 高耐压、良好导热性； High dielectric strength and good thermal conductivity;5. ARLON独有的压延控制技术确保材料一致性； Arlons exclusive calendering control technique ensures materials consistency;6. 特殊调整的有机硅配方确保材料简单易用： 对位组装-常温加压-加热固化-完成 Unique formulation of the organic silicon ensures simplicity of pr

11、ocess: Assembling-Pressing under normal terperature-Curing under heat,Secure 1500FG材料特性Characteristics of Secure 1500FG,材料可靠性测试 Reliability test of the material 150，1000小时长期高温老化测试，OK； Thermal Aging at 150 C for 1000 hours,Secure 1500FG材料特性Characteristics of Secure 1500FG,材料可靠性测试 Reliability test of

12、the material 80/85RH，1000小时高温高湿测试，OK； 80C/85RH -1000 hours,Secure 1500FG材料特性Characteristics of Secure 1500FG,材料可靠性测试 Reliability test of the material -40-150，1000cycles高低温循环测试，OK； Temperature Cycling- 1000 cycles -40 to 150 C,Secure 1500FG材料技术演进Technology Evolution of Secure 1500FG,Secure 1500FG材料的前

13、身：Thermabond thermalConductive adhesives。 主要用于航太产品、汽车电子等承受苛刻高低温冲击、振动环境条件下PCBA组件同heatsink的导热粘接，通过材料自身的良好弹性消除组件间的CTE失配，并将PCBA组件的发热快速传递到heatsink组件上。 The predecessor of Secure 1500FG was Thermalbond conductive adhesive,which was mainly used on aerospace products and automotive electronics to realize the

14、 thermal bond between PCBA and heat sink under thermal shock and vibrating environments,eliminating CTE missmatching between modules and quickly conducting heat from PCBA to heat sink by its own elasticity.,Secure 1500FG材料技术演进Technology Evolution of Secure 1500FG,Secure 1500FG材料应用工艺简介Application Pro

15、cess of Secure 1500FG,步骤1：材料准备Step1 Prepare the material,步骤2：剥去一侧离型膜，而后贴合与散热器安装面Step2 Peel off a release liner and joint the adhesive to the surface of heat sink,步骤3：剥去另一侧离型膜Step3 Peel off the other liner,步骤4：放置功率管（可借助夹具定位）Step4 Place power packages.A fixture may be needed,步骤5：常温加压Step5 Press power

16、packages under normal temperature,步骤6：加热固化Step6 Cure under heat,同其他功率器件安装方式对比Comparisons of mounting method between Secure 1500FG and other power devices,Vs 常规导热绝缘膜+螺钉安装方式 Compared to insulator+ bolts installation 1. 产品设计性能优势； 节省安装安装空间，极大提升电源产品功率密度； 耐压高，7mil材料标称4KVAC，9mil材料标称6KVAC，可用作基本绝缘场景。而通常螺钉安装方

17、式只能做到工作绝缘； 散热好，导热性能优于业界常用导热绝缘膜； Product design and performance advantages: Less installing space requirement significantly improves power products power density ; Resistant to high voltage.7mil materials nominal voltage is 4KVAC and 9mil material 6KVAC,which can be applied to basic insulation scene,

18、while the insulator + bolts installation can only make operational insulation; Better heat conducting performance than commonly used thermal insulating materials;,同其他功率器件安装方式对比Comparisons of mounting method between Secure 1500FG and other power devices,2. 综合成本优势； 散热器不需打孔、攻丝，制造成本低廉。综合成本低于常规导热绝缘膜+螺钉、弹

19、片、压条等安装方式； Combined cost advantage: No perforating or threading requirement for the heat sink,which lower down the cost;3. 制造优势； 制造环节质量一致性高，无常规方式操作不当导致经常出现的功率管应力损伤、绝缘膜刺穿耐压、陶瓷基片破裂等不良问题；可实现自动化无人装配。 Producing advantage: High consistency of quality during the process of production.No stress damage,punct

20、ure of voltage resistance or fracture of ceramic substrate and similar problems;automatic assembly is realizable;,同其他功率器件安装方式对比Comparisons of mounting method between Secure 1500FG and other power devices,Vs 常规导热绝缘压敏胶带安装方式 产品设计性能优势： 散热性能好，导热系数、综合热阻远低于导热绝缘压敏胶带； 对散热器平面度不敏感，散热器表面不需精铣处理。而导热绝缘压敏胶带其压敏胶层厚度通

21、常只有20um左右，较难填充补偿不平的散热器表面，既而影响到其粘接强度与接触热阻； 工作温度高：200 vs 120； 粘接强度远大于压敏胶带：500psi vs 200psi； 长期表面绝缘性能好：压敏胶带表面粘性，产品运行工作过程中更容易积灰，在高湿环境下表面耐压击穿；,同其他功率器件安装方式对比Comparisons of mounting method between Secure 1500FG and other power devices,Compared to installation of conventional pressure sensitive adhesive Pro

22、duct design and performance advantages: Good heat conducting performance,much lower integrative thermal resistance than thermal insulating pressure sensitve adhesive; Insensitiveness to planeness eliminates the need for finish milling of heat sink surface,while thermal insulating pressure sensitve a

23、dhesive films 2um thinckness makes it hard to bond thoroughly to heat sink,affecting the cohesional strength and thermal contact resistance; Working temperature comparison: 150 vs 120; Cohesional strength comparison: 500psi vs 200psi Long-term insulating performance, while pressure sensitive adhesiv

24、es viscosity accumulates dust during work process,which is much likely to puncture materials dielectrical strength;,同其他功率器件安装方式对比Comparisons of mounting method between Secure 1500FG and other power devices,Vs 业界同类材料 业界友商同类材料加热固化环节需要同时施加较大的压力，其粘接效果并易受各项工艺参数波动的影响。这带来了一系列的困难及问题：1. 需要大量的压力夹具投入；2. 夹具连同散热

25、器组件一起加热，加热热容量大，需要特殊的加热设备（铁板回流炉），同时能源消耗大；3. 耐压性能不好，实际达成耐压值远低于厂家标称值，不能用作基本绝缘，生产环节需100%耐压测试以保证质量；4. 应用限制大：传导加热方式，散热器背面带齿实现困难，散热器双面粘管实现困难；,同其他功率器件安装方式对比Comparisons of mounting method between Secure 1500FG and other power devices,Compared to similar materials within power industry More pressure is needed

26、 when curing similar power industry materials and the cohesional strength is susceptible to fluctuation of variable process parameters,which cause a series of difficulties and problems:1. A good amount of fixtures are needed;2. Heat sinks are heated with fixture,which enlarges heating capacity,consu

27、ming more heat and requires special heating facility (iron panel reflow oven);3. Poor voltage withstanding property.Actual voltage endurance is much lower than manufacturers nominal voltage,failing to serve for basic insulation.Dielectrical strength tests are always needed during process;4. More app

28、lication limitations: conductive heating,it is hard to realize toothed heat sinks and the technology of bonding power packages to both sides of heat sink.,优选应用工艺条件Preferable conditions of application process,散热器、功率管准备： 确保散热器、功率管待粘接表面无油污、汗迹，需要时建议先以无水酒精或电子清洗剂擦拭散热器表面。将绝缘膜剥去一侧离型膜，而后贴合到散热器表面： 绝缘膜对准散热器一边，

29、用手指或滚轮轻压，而后向前推动，将整个绝缘膜完整贴合到散热器表面，过程中避免引入气泡。如有气泡，可用手指将其轻轻挤出；,优选应用工艺条件Preferable conditions of application process,Preparation of heat sink and power packages： Make sure the bonding surfaces of both heat sink and power package are dirt free.Absolute alcohol or electronic washing agent may be needed fo

30、r scrubbing. Peel off a release liner of Secure 1500FG and joint the adhesive to the surface of heat sink: Place the adhesive to the heat sink and press it with fingers or a rollerbit by bit till it bonds thoroughly to the heat sink.Avoid bringing in bubbles.If bubbles are actually caused,squeeze th

31、em out with fingers;,优选应用工艺条件Preferable conditions of application process,剥去上表面离型膜： 以工具撬起上表面离型膜一角，而后以近似180剥离方式轻轻剥离离型膜，过程中需防止绝缘膜被重新带起或褶皱； 对位组装功率管 借助功率管定位夹具将功率管放置于绝缘膜上，并轻压。,Peel off the other liner: Pry up a corner of the liner with a tool and peel it off slightly with an angle of approximately 180,av

32、oid drawing back or wrinkling the material; Assemble power packages: Place power packages on the adhesive with a locating fixture and press them slightly.,优选应用工艺条件Preferable conditions of application process,优选应用工艺条件Preferable conditions of application process,常温加压预粘接： 借助压力可控的压力机对预组装的功率管加压一段时间； 推荐参数

33、：50-75psi，30s； 这个过程中，在压力作用下未固化凝胶状态的有机硅材料变形流动以填充接触界面的空气间隙，并形成良好的粘接润湿界面。,优选应用工艺条件Preferable conditions of application process,Pre-bonding with pressure under normal terperature: Press the bonding power packages by a forcing press whose pressure level is controllable for a period of time; Parameters re

34、commended:5075psi,30s; During this process,uncured organic silicon material stuffs the gapping place by distortion and form a decent moistened adhesive interface.,优选应用工艺条件Preferable conditions of application process,加热固化： 加热固化参数：绝缘膜位置加热固化时需达到150，5-10min的固化条件。实际生产过程中建议实测监控该处温度。 加热固化方式设备：热风加热方式，通用热风循环

35、烘箱或热风隧道炉、回流炉。基于生产连续性考虑，优选热风隧道炉、回流炉，设备规格基于产能需求。,优选应用工艺条件Preferable conditions of application process,Thermal curing: Parameters : temperature 150, time 510min.Temperature monitoring during curing is suggested. Facilities and methods: hot blast heating,hot air recirculation drying stove,hot air tunnel

36、 stove or reflow oven are generally used. Out of consideration for production continuity,hot air tunnel stove and reflow oven are preferable.Specification of equipment is based on production requirements.,优选应用工艺条件Preferable conditions of application process,完成组件检验： 可根据质量管控要求对完成组件进行非破坏性耐压测试、粘接力测试。Testing of finished module: Non-destructive dielectric strength test and cohesional strength test according to quality control demands are suggested.,Q&A?,谢谢！Thank you!,