LED厂商专利布局芯片专利网之六大势力Nichia-Buffer,Electrode, Activation, and White.Cree-Buffer ,SiC, ElectrodePhilip Lumileds-Electrode, Wafer Bonding, and Flip-ChipOsram-White Thin GaN Toyota Gosei-Buffer,Electrode and White Epistar and Taiwan-buffer ITO ElectrodeLED 制程介绍Epi process Sapphire Buffer layer U-GaN N-GaN Quantun well P-GaN ActivationChip process Mesa etching P-contact metal coating P,N pad metal coating Insulating coating Back side lapping and polishing Dicing or scribing Probing and sortingEpi的核心专利