Die BondWire BondSealing ProcessTESTINGWafer InputDie SawWafer CleanCuring基本封裝流程基本封裝流程CMOS Image Sensor CMOS Image Sensor 封裝型封裝型態態 CLCCCLCCPLCCPLCCWafer Level PackageWafer Level PackageSolid MoldingSolid MoldingOthersOthers什麼是什麼是LCC Type?LCC Type?Leadless Chip CarrierLCC Substrate LCC Substrate 的尺寸標示的尺寸標示. Borosilicate glass is any silicate glass having at least 5% of boric oxide in its composition. It has high resistance to temperature change and chemical corrosion. Not quite as convenient to f
