精选优质文档-倾情为你奉上非接触晶圆测试原理及应用张林海 张俊 赖海波 无锡华润华晶微电子有限公司五分厂摘 要：本文介绍非接触晶圆测试系统的原理和在半导体生产中的主要应用，包括以表面光电压测试（SPV）为基础的介质层可动电荷测试、C-V测试和I-V测试，体硅表面掺杂以及扩散长度、载流子寿命等应用。 关键词：非接触、电荷、SPV：This paper introducing non-contact electrical measurement system produce a medium application in the semi-conductor, mainly include the test principle, Surface photo voltage，Mobile charge, C-V and I-V, at the same time still some applications aiming at other equipmentses and materials in the semi-conductor.K
