线路板流程术语中英文对照.doc

线路板流程术语中英文对照流程简介：开料钻孔干膜制程压合减铜电镀塞孔防焊(绿漆/绿油) 镀金喷锡成型开短路测试终检雷射钻孔A. 开料( Cut Lamination)a-1 裁板( Sheets Cutting)a-2 原物料发料(Panel)(Shear material to Size)B. 钻孔(Drilling)b-1 内钻(Inner Layer Drilling )b-2 一次孔(Outer Layer Drilling )b-3 二次孔(2nd Drilling)b-4 雷射钻孔(Laser Drilling )(Laser Ablation )b-5 盲(埋)孔钻孔(Blind & Buried Hole Drilling)C. 干膜制程( Photo Process(D/F)c-1 前处理(Pretreatment)c-2 压膜(Dry Film Lamination)c-3 曝光