1、芯片封装方式大全各种 IC封装形式图片BGABall Grid ArrayEBGA 680LLBGA 160LPBGA 217LPlastic Ball Grid ArraySBGA 192LTSBGA 680LQFPQuad Flat PackageTQFP 100LSBGASC-70 5LSDIPSIPSingle Inline PackageSOSmall Outline PackageCLCCCNRCommunication and Networking Riser Specification Revision 1.2 CPGACeramic Pin Grid ArrayDIPDual
2、 Inline Package DIP-tabDual Inline Package with Metal HeatsinkFBGASOJ 32LSOJSOP EIAJ TYPE II 14LSOT220SSOP 16LSSOPTO18FDIPFTO220Flat PackHSOP28ITO220ITO3pJLCCTO220TO247TO264TO3TO5TO52TO71LCCLDCCLGALQFPPCDIPPGAPlastic Pin Grid Array PLCC详细规格PQFPTO72TO78TO8TO92TO93TO99TSOPThin Small Outline PackagePSD
3、IPLQFP 100L详细规格 METAL QUAD 100L详细规格PQFP 100L详细规格QFPQuad Flat PackageSOT220SOT223TSSOP or TSOP IIThin Shrink Outline PackageuBGAMicro Ball Grid ArrayuBGAMicro Ball Grid ArrayZIPZig-Zag Inline PackageTEPBGA 288L TEPBGA C-Bend Lead CERQUADCeramic Quad Flat SOT223SOT23SOT23/SOT323SOT25/SOT353SOT26/SOT36
4、3SOT343SOT523SOT89SOT89Pack详细规格Ceramic CaseLAMINATE CSP 112LChip Scale Package详细规格Gull Wing Leads LLP 8La详细规格PCI 32bit 5VPeripheral Component Interconnect详细规格PCI 64bit 3.3VSocket 603FosterLAMINATE TCSP 20LChip Scale PackageTO252TO263/TO268SO DIMMSmall Outline Dual In-line Memory ModuleSOCKET 370For
5、intel 370 pin PGA Pentium III & Celeron CPUPCMCIAPDIPPLCC详细规格SIMM30Single In-line Memory ModuleSIMM72Single In-line Memory ModuleSIMM72Single In-line SLOT 1For intel Pentium II Pentium III & Celeron CPUSOCKET 423For intel 423 pin PGA Pentium 4 CPUSOCKET 462/SOCKET AFor PGA AMD Athlon & Duron CPUSOCKET 7For intel Pentium & MMX Pentium CPUSLOT AFor AMD Athlon CPUSNAPTKSNAPTKSNAPZPSOH各种封 装 缩 写 说 明BGABQFP132BGABGA BGABGA BGA CLCC
