1、半導體封裝測試概論,講者 王量玄,大綱,半導體材料及相關應用領域積體電路種類積體電路製造封裝技術發展傳統封裝與晶圓級封裝(wafer level CSP)測試,半導體材料及相關應用領域,積體電路種類,邏輯(Logic) : CPU , 晶片組 (Chip_Set),繪圖晶片 .記憶體(Memory):ROM,SRAM,DRAM,Flash,積體電路製程,封裝技術發展ASE Assembly Milestone,傳統封裝與晶圓級封裝(wafer level CSP),傳統封裝 晶粒切割 晶粒貼附 打線 灌膠 彎腳成型 SOJ,晶圓級封裝(wafer level CSP),Balls pad op
2、en &Solder bumping,Wafer level final testing,Process Flow,Wafer incoming,CONFIDENTIAL,Process Flow,BCB coating,Sputter Ti/Cu,CONFIDENTIAL,Process Flow,CONFIDENTIAL,PR coating,Cu / Ni / Au traceplating,Process Flow,CONFIDENTIAL,PR stripping & Ti/Cuetching,Solder mask coating,Process Flow,CONFIDENTIAL
3、,Back side marking,Ball placement,Process Flow,Wafer level final testing,CONFIDENTIAL,Dicing sawPick & place,測試測試,Tester 測試機 Memory Tester , Logic Tester , Mix Tester .Handler (自動分類機) & Prober(自動針測機),Memory Tester,Handler,Wafer Level Final Testing,Load Board,X/Y/Z Step Motor,Wafer,Chuck,Solder Ball,Probe Card,Copper Post type,報告完畢 敬請指教 謝謝,
