1、电路板术语整理 5Solder Splash 贱锡.Solder Spread Test 散锡试验 .Solder Webbing 锡纲.Solder Webbing 锡纲.Solder Wicking 渗锡,焊锡之灯芯效应.Solderability 可焊性.Soldering 软焊,焊接.Soldering Fluid, Soldering Oil助焊液,护焊油.Solid Content 固体含量,固形分.Solidus Line 固相线.Spacing 间距 .Span 跨距.Spark Over 闪络 .Specific Heat 比热.Specification (Spec)规范,
2、规格.Specimen 样品,试样.Spectrophotometry分光光度计检测法.Spindle 主轴,钻轴.Spinning Coating 自转涂布.Splay 斜钻孔.Spray Coating 喷着涂装.Spur 底片图形边缘突出.Sputtering 溅射.Squeege 刮刀.Stagger Grid 蹒跚格点.Stalagometer 滴管式表面张力计.Stand-off Terminals 直立型端子.Starvation 缺胶.Static Eliminator 静电消除器.Steel Rule Die(钢)刀模.Stencil 版膜.Step and Repeat 逐
3、次重复曝光.Step Plating 梯阶式镀层.Step Tablet 阶段式曝光表.Stiffener 补强条(板).Stop Off 防镀膜, 阻剂.Strain 变形,应变.Strand 绞( 指由许多股单丝集束并旋扭而成的丝束).Stray Current 迷走电流, 散杂电流(在电镀槽系统中,其直流电 由整流器所提供,应在阳极板与被镀件之间的汇电杆与槽体液体中流通,但有时少部分电流也可能会从槽体本身或加热器上迷走,漏失).Stress Corrosion 应力腐蚀.Stress Relief 消除应力.Strike 预镀.Stringing 拖尾.Stripline 条线.Stri
4、pper 剥除液 (器).Substractive Process 减成法.Substrate 底材.Supper Solder 超级焊锡.Supported Hole(金属)支助通孔 .Surface Energy 表面能.Surface Insulation Resistance 表面绝缘电阻.Surface Mount Device 表面粘装组件.Surface Mounting Technology (SMT)表面粘装技术.Surface Resistivity 表面电阻率 .Surface Speed 钻针表面速度.Surface Tension 表面张力 .Surfactant 表
5、面润湿剂.Surge 突流,突压.Swaged Lead 压扁式引脚 .Swelling Agents, Sweller 膨松剂.Swimming 线路滑离.Synthetic Resin 合成树脂. *T*Tab 接点,金手指.Taber Abraser 泰伯磨试器.Tackiness 粘着性, 粘手性 .Tape Automatic Bonding (TAB)卷带自动结合.Tape Casting 带状铸材.Tape Test 撕胶带试验.Tape Up Master 原始手贴片.Taped Components 卷带式连载组件.Taper Pin Gauge 锥状孔规.Tarnish污化
6、.Tarnish 污化, 污着.Teflon 铁氟龙(聚 4 氟乙烯).Telegraphing 浮印,隐印.Temperature Profile 温度曲线.Template 模板.Tensile Strength抗拉强度.Tensiomenter 张力计.Tenting 盖孔法.Terminal 端子.Terminal Clearance 端子空环 .Tetra-Etch 氟树脂蚀粗剂.Tetrafunctional Resin 四功能树脂.Thermal Coefficient of Expansion (TCE)热膨胀系数.Thermal Conductivity 导热率.Therma
7、l Cycling 热循环,热震荡.Thermal Mismstch 感热失谐.Thermal Relief 散热式镂空.Thermal Via 导热孔.Thermal Zone 感热区.Thermocompression Bonding 热压结合.Thermocouple 热电偶.Thermode 发热体.Thermode Soldering 热模焊接法.Thermogravimetric Analysis, (TGA)热重分析法 .Thermomechanical Analysis (TMA)热机分析法 .Thermoplastic 热塑性.Thermosetting 热固性.Thermo
8、sonic Bonding 热超音波结合.Thermount 聚醯胺短纤席材.Thermo-Via 导热孔.Thick Film Circuit 厚膜电路.Thief 辅助阳极.Thin Copper Foil 薄铜箔.Thin Core 薄基板.Thin Film Technology 薄膜技术.Thin Small Outline Package(TSOP)薄小型绩体电路器.Thinner 调薄剂.Thixotropy 抗垂流性,摇变性.Three Point Bending 三点压弯试验.Three-Layer Carrier 三层式载体.Threshold Limit Value (T
9、LV)极限值.Through Hole Mounting 通孔插装.Through Put 物流量,物料通过量.Throwing Power 分布力.Tie Bar 分流条.Tin Drift 锡量漂飘失.Tin Immersion 浸镀锡.Tin Pest 锡疫(常见白色金属锡为“ 锡“,当温度低于 13.2时则 锡将逐渐转变成粉末状灰色“ 锡“称为“锡疫“.Tin Whishers 锡须.Tinning 热沾焊锡.Tolerance 公差 .Tombstoning 墓碑效应.Tooling Feature 工具标示物.Topography 表面地形.Torsion Strength抗扭强度
10、.Touch Up 触修 ,简修.Trace 线路,导线 .Traceability 追溯性,可溯性.Transducer 转能器.Transfer Bump 移用式突块.Transfer Laminatied Circuit 转压式线路.Transfer Soldering 移焊法.Transistor 晶体管.Translucency 半透性.Transmission Line 传输线.Transmittance 透光率.Treament, Treating 含浸处理.Treeing 枝状镀物,镀须.Trim 修整, 精修.Trim Line 裁切线.Trimming 修整,修边.True
11、 Position 真位.Tungsten 钨 Tungsten Carbide 碳化钨.Turnkey System 包办式系统.Turret Solder Terminal 塔立式焊接端子.Twill Weave 斜织法.Twist 板扭.Two Layer Carrier 两层式载体. *U*UL Symbol(UL.为 Under-Writers 保俭业试验所标志. Laboratories,INC)Ultimate Tensile Strength (UTS)极限抗拉强度.Ultra High Frequency (UHF)超高频率.Ultra Violet Curing (UV C
12、uring)紫外线硬化.Ultrasonic Bonding 超音波结合.Ultrasonic Cleaning 超音波清洗.Ultrasonic Soldering 超音波焊接.Unbalanced Transmission Line 非平衡式传输线.Undercut, Undercutting 侧蚀.Underplate 底镀层.Universal Tester 汛用型电测机 .Unsupported Hole 非镀通孔.Urea 尿素.Urethane 胺基甲酸乙脂. *V*Vacuoles 焊洞.Vacuum Evaporation(or Deposition)真空蒸镀法.Vacuum
13、 Lamination 真空压合.Van Der Waals Force 凡得华力.Vapor Blasting 蒸汽喷砂.Vapor Degreasing 蒸汽除油法.Vapor Phase Soldering 气相焊接.Varnish 凡力水,清漆(树脂之液态单体).V-cutV 型切槽.Very Large-Scale Integration(VLSI)极大绩体电路器 .Via Hole 导通孔.Vickers Hardness 维氏硬度.Viscosity 粘滞度,粘度.Vision Systems视觉系统.Visual Examination 目视检验.Void 破洞,空洞.Vola
14、tile Content 挥发份含量.Voltage 电压.Voltage Breakdown 崩溃电压.Voltage Drop 电压降落.Voltage Efficiency 电压效率.Voltage Plane 电压层.Voltage Plane Clearance 电压层的空环.Volume Resistivity 体绩电阻率.Volume Resistivity 体绩电阻率.Volumetric Analysis 容量分析法.Vulcanization 交联,硫化. *W*Wafer 晶圆.Waive 暂准过关,暂不检查.Warp Size 浆经处理.Warp, Warpage 板弯.Washer 垫圈.Waste Treatment 废弃处理.Water Absorption 吸水性.Water Break 水膜破散,水破.Water Mark 水印. Watt 瓦特.Watts Bath 瓦兹镀镍液.Wave Guide 导波管.Wave Soldering波焊.Waviness 波纹,波度.Wear Resistance 耐磨性,耐磨度.Weatherability 耐候性.Weave Eposure 织纹显露.Weave Texture 织纹隐现.Web 蹼部.
