1、 Dell Controlled PrintReliability Qualification Requirements for Lead-Free ProductsNumber: D4559Revision: A02Engineers/Owners: Dell Reliability OrganizationDELL CONFIDENTIALTHIS ITEM IS THE PROPERTY OF DELL CORPORATION, AUSTIN, TEXAS AND CONTAINS CONFIDENTIAL AND TRADE SECRET INFORMATION. THIS ITEM
2、MAY NOT BE TRANSFERRED FROM THE CUSTODY OF DELL COMPUTER CORP., AND THEN ONLY BY WAY OF LOAN FOR LIMITED PURPOSES. IT MUST NOT BE REPRODUCED IN WHOLE OR IN PARTS AND MUST BE RETURNED TO DELL COMPUTER CORP. UPON REQUEST AND IN ALL EVENTS UPON COMPLETION OF THE PURPOSE OF THE LOAN. NEITHER THIS ITEM N
3、OR THE INFORMATION IT CONTAINS MAY BE USED BY OR DISCLOSED TO PERSONS NOT HAVING A NEED FOR SUCH USE OR DISCLOSURE CONSISTENT WITH THE PURPOSE OF THE LOAN WITHOUT THE PRIOR WRITTEN CONSENT OF DELL COMPUTER CORPORATION.WWW.DELL.COMTable of Contents1.0 Revision History .32.0 Introduction.42.1 Purpose/
4、Objective.42.2 Scope.42.3 Supporting Documents .42.4 Procedure .53.0 Qualification Requirements for Level 1 .63.1 Materials Used .63.2 Process Information .63.3 Component Information.73.3.1 Heat Resistance.73.3.2 Moisture Sensitivity.73.3.3 Lead Plating .83.4 Sample Distribution .103.5 Assembly and
5、Inspection (this step is not required for Level 2 and Level 3 products where 4.1 applies).104.0 Qualification Requirements for Level 2 .114.1 Precondition / Assembly.114.2 Vibration and Shock .124.3 Thermal Cycling .124.4 Highly Accelerated Life Testing (HALT) .125.0 Qualification Requirements for L
6、evel 3 .145.1 .145.2 Torsion Testing (for notebook computers only).145.3 BGA Package Coplanarity.156.0 Appendix: Pb-Free Risks.166.1 Appendix: Examples of Test Flows.177.0 References.181.0 Revision History .32.0 Introduction.42.1 Purpose/Objective.42.2 Scope.42.3 Supporting Documents .42.4 Procedure
7、 .43.0 Qualification Requirements for Level 1 .53.1 Materials Used .63.2 Process Information .63.3 Component Information.73.3.1 Heat Resistance.73.3.2 Moisture Sensitivity.73.3.3 Lead Plating .73.4 Sample Distribution .9PG Engineering Specification Document Number: D4559Title: Qualification Requirem
8、ents- Lead Free Product Revision: A02Dell Reliability Engineering 3 of 23 10/28/20045/21/20193.5 Assembly and Inspection (this step is not required for Level 2 and Level 3 products where 4.1 applies).94.0 Qualification Requirements for Level 2 .104.1 Precondition / Assembly.104.2 Vibration and Shock
9、 .114.3 Thermal Cycling .114.4 Highly Accelerated Life Testing (HALT) .115.0 Qualification Requirements for Level 3 .135.1 .135.2 Torsion Testing (for notebook computers only).135.3 BGA Package Coplanarity.146.0 Appendix: Pb-Free Risks.156.1 Appendix: Examples of Test Flows.167.0 References.17PG Eng
10、ineering Specification Document Number: D4559Title: Qualification Requirements- Lead Free Product Revision: A02Dell Reliability Engineering 4 of 23 10/28/20045/21/20191.0 Revision HistoryRevision ECO Description Approved DateA00 155640 Initial Release to A00-00 Ed Tinsley 12/17/03A01 161025 Clarifie
11、d Reliability scope for process related requirements. Outlined failure modes. Solderability requirements removed. Requirement for component tables removed. Added Sn whisker table. Clarified component delamination criteria per J-STD-020B. Clarified HALT requirement. Reduced the requirements for preco
12、nditioning and assembly. Removed ImAg migration testing. Ed Tinsley 4/28/04A02 171570 Specified Tin Whisker requirement specific to FFC/FPC. Clarified heat resistance, and MSL requirement, and Tin Whisker requirement. (Mike Ernie)Ed Tinsley 10/28/04PG Engineering Specification Document Number: D4559
13、Title: Qualification Requirements- Lead Free Product Revision: A02Dell Reliability Engineering 5 of 23 10/28/20045/21/20192.0 Introduction2.1 Purpose/ObjectiveThis document details Dell Corporations requirements for qualification of lead-free printed circuit board assemblies (PCBAs) supplied directl
14、y or indirectly to Dell for use in Dell branded products. These requirements are subject to change based on further industry study and technological changes relating to lead-free solders and parts. This qualification requirements document is to be used in conjunction with Dell P/N D4394 General Spec
15、ification for Allowable Levels of Lead (Pb) in Dell Products and Dell P/N M4461 which provides Pb-free requirements for individual components used in Dell products. 2.2 ScopeThe requirements listed in this document cover lead-free alloys such as SnCu, SnAg or SnAgCu, with liquidus temperatures below
16、 227C. Exemptions to Pb-free solder are allowed in Dell products according to the latest RoHS RoHS directives (or as determined by Dells Environmental group). The Dell preferred Pb-free alloy is SnAgCu in the composition range Sn(3.0-4.0)Ag(0.5-0.9)Cu. Lead-free solder alloys with melting temperatur
17、e greater than 227C or those containing Bi, In, or Zn are unacceptable at this time due to reliability, supply, and or corrosion concerns. Preferred component lead finish is matte Sn over 1.3m Ni, however others are acceptable if Sn whisker risk is mitigated. Preferred board finish is immersion Ag (
18、0.15 - 0.5 m thick). However other surface finishes will also be acceptable in certain applications (i.e. Ni/Au plated, high temperature rated OSP materials, immersion Sn, etc.). 2.3 Supporting Documents Agile accessible via the ValueChain website (https:/ for Suppliers/Vendors. General Specificatio
19、n for Allowable Levels of Lead (Pb) in Dell Products (Dell P/N D4394) located in Agile. Lead Free Component Requirements (Dell P/N M4461) located in Agile. Dell Restricted Material Spec (Dell P/N 6T198) located in Agile. Dell Supplier Declaration on Restricted or Banned Materials (Dell P/N 7X435) lo
20、cated in Agile. Directive of the European Parliament and of the Council on the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment, 2000/159/COD, October 2002. (RoHS Directive) Directive of the European Parliament and of the Council on Waste Electrical and E
21、lectronic Equipment, 2000/0158/COD, October 2002. (WEEE Directive) 91/157/EEC as amended by Directive 98/101/EC, Batteries and accumulators containing certain dangerous substances.PG Engineering Specification Document Number: D4559Title: Qualification Requirements- Lead Free Product Revision: A02Del
22、l Reliability Engineering 6 of 23 10/28/20045/21/20192.4 ProcedurePrior to the start of qualification testing it is expected that the supplier has performed extensive process optimization studies for Pb-free. DOEs should have been run to select the best solder paste material for screen printing and
23、solder joint integrity. Optimum reflow parameters and an acceptable process window should be determined. Necessary wave solder and rework procedures should be finalized and inspection methods determined. It is expected that the process conditions and materials used to build products for qualificatio
24、n are locked-in for the foreseeable future. This qualification document consists of three levels of testing requirements. The qualification level is based on product complexity, reliability expectations and risk to customers. The Level 1 requirements apply to relatively simple Dell components/produc
25、ts with a lower implied risk of failure due to lead-free materials and processing. Level 2 applies to products with moderate complexity and risk of failure while Level 3 is meant to address more complex Dell products with highest expected reliability. Prior to initiation of testing, the supplier sha
26、ll obtain written confirmation from Dell of the required qualification level required for their product.Prior to any testing a detailed test plan should be developed and agreed upon by all involved parties. This plan should include specific tests, testing location, sample sizes, pass/fail criteria,
27、etc. Sample sizes for component level testing and evaluation will be according to specification unless specifically modified by Dell. Reliability evaluation will be performed at a Dell approved test site unless otherwise agreed prior to start of the project.A control group will be required for compa
28、rison purposes and may consist of the same product assembled with SnPb solder or a previous generation of SnPb product of same complexity. Control group type will be determined by mutual agreement between Dell and the supplier.The qualification criteria listed are in addition to standard qualificati
29、on testing already expected of the supplier and any used by the supplier to qualify their current processes. Each supplier is required to submit a report detailing the test conditions, sample sizes, evaluation procedures and test results for any testing that was performed separately from Dell requir
30、ement. At Dell discretion, based on coverage of testing already performed and results provided, all or part of the requirements in this document may be modified. In some cases Dell may require additional testing to determine test limits and failure mechanisms associated with certain higher risk comp
31、onents. PG Engineering Specification Document Number: D4559Title: Qualification Requirements- Lead Free Product Revision: A02Dell Reliability Engineering 7 of 23 10/28/20045/21/20193.0 Qualification Requirements for Level 1This level is reserved for products with lower perceived risk of failure due to introduction of lead-free materials and processing. Products determined to be in this level are relatively simple and constructed exclusively with components such as passives, through-hole and/or coarse pitch (0.5 mm) surface mount leaded packages. So
