1、封装形式：封装形式是指安装半导体集成电路芯片用的外壳。它不仅起着安装、固定、密封、保护芯片及增强电热性能等方面的作用，而且还通过芯片上的接点用导线连接到封装外壳的引脚上，这些引脚又通过印刷电路板上的导线与其他器件相连接。衡量一个芯片封装技术先进与否的重要指标是芯片面积与封装面积之比，这个比值越接近 1 越好。封装大致经过了如下发展进程：结构方面：TODIPLCCQFPBGA CSP；材料方面：金属、陶瓷陶瓷、塑料塑料；引脚形状：长引线直插短引线或无引线贴装球状凸点；装配方式：通孔插装表面组装直接安装。英文简称 英文全称 中文解释DIP Double In-line Package双列直插式封装
2、。插装型封装之一，引脚从封装两侧引出，封装材料有塑料和陶瓷两种。DIP 是最普及的插装型封装，应用范围包括标准逻辑 IC，存贮器 LSI，微机电路等。PLCC Plastic Leaded Chip CarrierPLCC 封装方式，外形呈正方形，32 脚封装，四周都有管脚，外形尺寸比DIP 封装小得多。PLCC 封装适合用 SMT 表面安装技术在 PCB 上安装布线，具有外形尺寸小、可靠性高的优点。PQFP Plastic Quad Flat PackagePQFP 封装的芯片引脚之间距离很小，管脚很细，一般大规模或超大规模集成电路采用这种封装形式，其引脚数一般都在 100 以上。SOP S
3、mall Outline Package19681969 年菲为浦公司就开发出小外形封装（SOP） 。以后逐渐派生出SOJ（J 型引脚小外形封装） 、TSOP（薄小外形封装） 、VSOP（甚小外形封装）、SSOP（缩小型 SOP） 、TSSOP（薄的缩小型 SOP）及 SOT（小外形晶体管） 、SOIC（小外形集成电路）等。常见英文缩写解释（按字母顺序排列）：ASIC Application Specific Integrated Circuit 专用 ICCPLD Complex Programmable Logic Device 复杂可编程逻辑器件EDA Electronic Design
4、 Automation 电子设计自动化FPGA Field Programmable Gate Array 现场可编程门阵列GAL Generic Array Logic 通用阵列逻辑HDL Hardware Description Language 硬件描述语言IP Intelligent Property 智能模块PAL Programmable Array Logic 可编程阵列逻辑RTL Register Transfer Level 寄存器传输级描述SOC System On a Chip 片上系统SLIC System Level IC 系统级 ICVHDL Very high s
5、peed integrated circuit Hardware Description Language 超高速集成电路硬件描述语言英文全称 英文简称 中文名称ACROSecure ACROSecure 宏聚科技（深圳）有限公司8x8, Inc. 8x8 8x8ACC Microelectronics Corp. ACC Micro ACC MicroAcer Laboratories, Inc. Acer Laboratories Acer LaboratoriesActel Corporation Actel ActelAnalog Devices Inc. AD 模拟器件Adaptec
6、, Inc. Adaptec AdaptecAdvanced Hardware Architectures, Inc. Advanced Hardware Advanced HardwareAdvanced Micro Devices, Inc. Advanced Micro 先进线性器件公司Aeroflex Circuit Technology Aeroflex AeroflexAgilent Technologies, Ltd. AGILENT 安捷伦AITech International AITech Intl AITech IntlAKM Semiconductor, Inc. AK
7、M Semi AKM SemiAllegro Micro Systems, Inc. ALLEGRO ALLEGROAlliance Semiconductor Alliance Semi 联合半导体ALLTEK ALLTEK ALLTEKAlpha Semiconductor Alpha Semi Alpha SemiAltera Corporation Altera AlteraAdvanced Micro Devices, Inc. AMD 先进微器件American Microsystems, Inc. American Micro 美国微系统公司AMI AMI AMIAMP Inco
8、rporated AMP 安普AMPHENOL AMPHENOL AMPHENOLAMTRON AMTRON AMTRONAnadigics, Inc. Anadigics AnadigicsAnalogic Corporation Analogic AnalogicApex Microtechnology Corporation Apex Micro Apex MicroAMCC (Applied Micro Circuits Corp) Applied Micro Circuits Applied Micro CircuitsAptek Williams, Inc. Aptek Willi
9、ams Aptek WilliamsAptos Semiconductor Corporation Aptos Semi Aptos SemiArizona Microtek, Inc. Arizona Microtek 亚利桑那Array Microsystems Array Micro Array MicroARTESYN ARTESYN ARTESYNASILIANT ASILIANT ASILIANTAstec Semiconductor Astec Semi Astec SemiAtmel Corporation ATMEL 爱特美尔AUCTOR MAPLE AUCTOR MAPLE
10、 AUCTOR MAPLEAUDIOCODES AUDIOCODES AUDIOCODESAustin Semiconductor, Inc. Austin Semi Austin SemiAustria Mikro Systeme International, Inc. Austria Mikro 奥地利微系统AverLogic Technologies, Inc. Averlogic AverlogicAVX Corporation. AVX AVXBurr-Brown Corporation BB 布尔布朗Bel Fuse Incorporated Bel Fuse Bel FuseBI
11、 BI BIBourns,Inc. BOURNS 布尔BethelTronix, Inc. BT BTC & D Technologies C & D Technologies C & D TechnologiesCalifornia Micro Devices Corporation California Micro 加利福尼亚微器件Calogic Corporation Calogic CalogicCatalyst Semiconductor Catalyst Semi Catalyst SemiCEACSZ CEACSZ 中国电子器材公司深圳公司Centon Electronics,
12、Inc. Centon Elctrns Centon ElctrnsCentury Microelectronics, Inc. Century Micro 世纪微电子Cermetek Microelectronics, Inc. Cermetek Micro Cermetek MicroCherry Semiconductor Corporation Cherry Semi 安森美Chip Express Corporation CHIP CHIPChrontel Chrontel ChrontelCirrus Logic, Inc. Cirrus Logic Cirrus LogicCle
13、ar Logic Clear Logic Clear LogicCMD Technology, Inc. CMD CMDCologne Chip Designs Cologne Chip Designs Cologne Chip DesignsConexant Systems, Inc. Conexant ConexantConsumer Microcircuits Limited Consumer Microcircuits Consumer MicrocircuitsCOSEL COSEL COSELCybernetic Micro Systems Cybernetic Micro Cyb
14、ernetic MicroCypress Semiconductor Corp. Cypress Semi Cypress SemiCyrix Corporation Cyrix CyrixDAEWOO Daewoo DaewooDallas Semiconductor DALLAS 达拉斯DALSA Incorporated DALSA DALSAData Delay Devices, Inc. Data Delay Data DelayDatel, Inc. Datel DatelDavicom Semiconductor Incorporated Davicom DavicomDense
15、-Pac Microsystems, Inc. Dense-Pac Dense-PacDigital Semiconductor Digital Semi Digital SemiDii Semiconductor Dii Semiconductor Dii SemiconductorDionics Inc. Dionics DionicsDSP Group, Inc. DSP Group DSP GroupDVSI DVSI DVSIEdge Technology, Inc. Edge Technology Edge TechnologyEG&G IC Sensors EG&G IC Sen
16、sors EG&G IC SensorsElantec Semiconductor, Inc. Elantec ElantecElectronic Technology Corporation Electronic Technology 电磁科技公司EM Microelectronic EM Micro EM Microemerson EMERSON emersonEnhanced Memory Systems, Inc. Enhanced Memory Enhanced MemoryEpson Electronics America, Inc. Epson America 爱普生Ericss
17、on Ericsson EricssonESS Technology, Inc. ESS Technology ESS TechnologyExar Corporation EXAR EXAREXEL Microelectronics, Inc. Exel ExelFABLA FABLA FABLAFairchild Semiconductor Corporation Fairchild 仙童FCI FCI FCIFINE FINE FINEFSC FSC FSCFujitsu Microelectronics, Inc. FUJI FUJGalileo Technology Galileo
18、Technology Galileo TechnologyGalvantech, Inc. Galvantech GalvantechGateField Corporation GateField GateFieldGenesis Microchip Inc. Genesis Microchip Genesis MicrochipGennum Corporation Gennum GennumGIGA A/S GIGA A/S GIGA A/SG-Link Technology Corporation G-Link Tech G-Link TechGOLDSTAR GOLDSTAR GOLDS
19、TARGalaxy Power, Inc. GP GPGoal Semiconductor GS GSGSI Technology GSI Technology GSI TechnologyGSV GSV GSVHarris Semiconductor HAR HARHewlett-Packard Components Group Hewlett-Packard Hewlett-PackardHifn Hifn HifnHIMARK HIMARK HIMARKHitachi Semiconductor (America), Inc. HIT HITHualon Microelectronics
20、 Corp HMC HMCHoltek Semiconductor Inc. HOLTEK HOLTEKHOT HOT HOTHewlett-Packard Components Group HP HPHT Communications HT HTHT Communications HTC HTCHUBER+SUHNER HUBER+SUHNER HUBER+SUHNERHyundai Electronics America HY HYIBM Corporation IBM IBMIC Haus IC Haus IC HausIC WORKS, Inc. IC WORKS IC WORKSIC
21、SI ICSI ICSIICT Corporation ICT ICTIDT IDT IDTIMP, Inc. IMP IMPImpala Linear Corporation Impala Linear Impala LinearInfineon Technologies Infineon 亿恒科技Information Storage Devices, Inc Information Storage Information StorageIntegrated Circuit Systems, Inc. Integrated Circuit 集成电路系统公司Integrated Logic
22、Systems Inc. Integrated Logic 集成逻辑系统公司Integrated Silicon Solution Inc. Integrated Silicon SolutionIntegrated Silicon SolutionIntegrated Technology Express, Inc. Integrated Technology Express联阳半导体Intel Corporation INTEL INTELIntellon Corporation Intellon IntellonInternational Microcircuits, Inc. Inte
23、rnational Micro 国际微电路公司Intersil Corporation INTERSIL INTERSILIntronics, Inc. Intronics IntronicsInternational Rectifier IR IRIsocom Incorporated Isocom IsocomISSI ISSI ISSIIXYS Corporation IXYS IXYSJapan Radio Company JRC JRCKawasaki LSI, USA Kawasaki LSI Kawasaki LSIKEC Corp. KEC KECKODENSHI KODENS
24、HI KODENSHILambda Advanced Analog Lambda Advanced 兰姆达公司Lansdale Semiconductor, Inc. Lansdale Semi Lansdale SemiLanwave Components, Inc. Lanwave Components Lanwave ComponentsLattice Semiconductor Corp. Lattice 晶格半导体Level One Level One Level OneLG LG LGLibit Signal Processing Ltd Libit Signal Processi
25、ng Libit Signal ProcessingLinear Integrated Systems Linear Integrated Linear IntegratedLinear Technology Corporation Linear Tech 凌特Linfinity Microelectronics Linfinity Micro Linfinity MicroLINFLNTTY LINFLNTTY LINFLNTTYLite-On, Inc. LITEON LITEONLITERON LITERON LITERONLITTEFUSE LITTEFUSE LITTEFUSELNF
26、 LNF LNFLogic Devices Inc. Logic Devices 逻辑器件LSI Computer Systems, Inc. LSI Computer LSI ComputerLSI Logic Corporation LSI Logic LSI LogicLucent Technologies Inc. Lucent 朗讯科技M/A M/A M/AMacronix America, Inc. Macronix 旺宏电子Maker Communications, Inc. Maker Communications Maker CommunicationsMARVELL MAR
27、VELL MARVELLMarvell Semiconductor, Inc. Marvell Semi Marvell SemiMaxim Integrated Products MAXIM MAXIMMelexis, Inc. Melexis MelexisMHS MHS MHSMicrel Semiconductor Micrel MicrelMicro Linear Micro Linear Micro LinearMicrochip Technology, Inc. MICROCHIP MICROCHIPMicrocosm Communications Ltd. Microcosm
28、Communications Microcosm CommunicationsMicron Semiconductor Products Inc. Micron Semiconductor ProductsMicron Semiconductor ProductsMicropac Industries, Inc. Micropac MicropacMICROSEMI MICROSEMI MICROSEMIMINDSPEED MINDSPEED MINDSPEEDMini-Circuits Mini-Circuits Mini-CircuitsMitsubishi Electronics Ame
29、rica, Inc. MIT MITMitel Corporation MITEL 敏迪MITSUBISHI MITSUBISHI MITSUBISHIMixed Signal Integration Corporation Mixed Signal Integration Mixed Signal IntegrationMOSYS Monolithic System Tech Monolithic System TechMosaic Semiconductor, Inc. Mosaic Semi Mosaic SemiMosel-Vitelic MOSEL MVMotorola Semico
30、nductorProducts Sector MOT 摩托罗拉Martek Power, Boston MP MPMSIS Semiconductor, Incorporated MSIS Semi MSIS SemiM-Systems Inc. M-Systems M-SystemsMURATA MURATA MURATAMusic Semiconductors, Inc. Music Semi Music SemiMW MW MWMX-COM, Inc. MX-COM MX-COMNanoAmp Solutions, Inc. NanoAmp Solutions, Inc. NanoAmp
31、 Solutions, Inc.NEC Electronics Inc. NEC NECNetLogic Microsystems, Inc. NetLogic NetLogicNexFlash Technologies, Inc. NexFlash NexFlashNJR Corporation NJRC NJRCNJRC NJRC NJRCNational Semiconductor Corporation NS 国半NTE Electronics, Inc. NTE NTENVIDIA Corporation NVIDIA NVIDIAOak Technology, Inc. Oak T
32、ech Oak TechOKI Semiconductor OKI 冲电气OMRON OMRON OMRONON Semiconductor ON-SEMI 安森美Optek Technology, Inc. Optek Tech Optek TechOPTi Inc. OPTi OPTiOptotek Limited Optotek OptotekOTAX OTAX OTAXOxford Micro Devices, Inc. Oxford Micro 牛津微器件P_DUKE P_DUKE P_DUKEPanasonic Industrial Company/Electronic Compo
33、nentsPanasonic 松下PC-TEL, Inc. PC-TEL PC-TELPerformance Motion Devices, Inc. Performance Motion Performance MotionPerformance Semiconductor Corp. Performance Semi 高性能半导体Pericom Semiconductor Corporation Pericom Semi Pericom SemiPhilips Semiconductors Philips 飞利浦Philsar Semiconductor Inc. Philsar Phil
34、sarPhylon Inc. Phylon PhylonPower Integrations, Inc. PI 美国能源PLX Technology, Inc. PLX Tech PLX TechPMC-Sierra PMC-Sierra PMC-SierraPROTEK PROTEK PROTEKPTC PTC PTCQLogic Corporation QLogic QLogicQuality Semiconductor QSI QSIQT Optoelectronics Corporation QTC QTCQuickLogic Corp QuickLogic QuickLogicRAD
35、 RAD RADRalec electronic Corp. RALEC 旺诠RCA Semiconductor RCA RCARealtek Semiconductor Corporation Realtek Semiconductor Realtek SemiconductorRFLAB RFLAB RFLABRICOH RICOH RICOHRochester Electronics Incorporated Rochester RochesterROHM Electronics ROHM 罗姆RUBYCON RUBYCON RUBYCONS3 Incorporated S3 S3Sam
36、sung Semiconductor, Inc. SAMSUNG 三星SANKEN SANKEN SANKENSanyo Semiconductor Corporation SANYO 三洋Scenix Semiconductor Inc. Scenix Semi Scenix SemiSeiko Instruments USA, Inc. Seiko Instruments 美国精工仪器公司SEIKO*EPSON SEIKO*EPSON SEIKO*EPSONSemtech Corporation Semtech SemtechSensory, Inc. Sensory SensorySEP
37、 SEP SEPSG SG SGSharp Microelectronics of the Americas SHARP 夏普Shindengen America, Inc. Shindengen America Shindengen AmericaSIEMENS SIEMENS SIEMENSSignal Processing Technologies Signal Processing Tech Signal Processing TechSII SII SIISiliconix Ltd. SILICON SILICONIXSilicon Composers, Inc. Silicon C
38、omposers Silicon ComposersSilicon Integrated Systems Corporation Silicon Integrated Systems 矽统科技Simtek Corporation Simtek SimtekSipex Corporation Sipex SipexSIS Microelectronics, Inc. SIS Microelectronics SIS MicroelectronicsSMC SMC SMCSolitron Devices, Inc. Solitron Devices Solitron DevicesSony Sem
39、iconductor Company of America SONY 索尼SPIRENT SPIRENT SPIRENTSilicon Storage Technology, Inc. SST SSTST Microelectronics, Inc. ST STStandard Microsystems Corporation Standard Micro Standard Microstonesonic STONESONIC stonesonicSumitomo Metals/JPA Sumitomo Metals/JPA Sumitomo Metals/JPASummit Microele
40、ctronics, Inc. Summit Microelectronics Summit MicroelectronicsSun Microsystems, Inc. Sun Micro 太阳微系统TCL TCL TCLTDK TDK TDKTELCOM TELCOM TELCOMTEMIC Semiconductors TEMIC TEMICTEMIC TEMIC TEMICTFK TFK TFKQT Texas Instruments, Inc. TI 德州仪器TIKO TIKO 深圳市声视宝实业有限公司Toshiba America Electronic Components, Inc
41、. TOS 东芝United Microelectronics Corporation UMC UMCUnisonic Technologies Co.,Ltd. UTC 友顺科技Vantis Corporation Vantis VantisVIA VIA VIAVICOR VICOR VICORVISHAY VISHAY VISHAYVishay Siliconix Vishay Siliconix Vishay SiliconixVLSI Technology Inc. VLSI VLSIWinbond Microelectronics North America Corp. WINBO
42、ND 华邦XHKY XHKY XHKYXicor,inc. Xicor XicorXilinx Corp. XILINX 赛灵斯Zilog Zilog Zilogwww.maxim-模拟滤波器 光纤通信 高速信号处理和转换 无线/射频光线通讯，模拟 显示支持电路 高频模拟和混合信号 ASIC数字转换器，接口，电源管理，电池监控 DC/DC 电源 电压基准MAXIM 前缀是“MAX” 。DALLAS 则是以“DS”开头。MAX或 MAX说明：1 后缀 CSA、CWA 其中 C 表示普通级，S 表示表贴，W 表示宽体表贴。2 后缀 CWI 表示宽体表贴，EEWI 宽体工业级表贴，后缀 MJA 或
43、883 为军级。3 CPA、BCPI、BCPP、CPP、CCPP、CPE、CPD、ACPA 后缀均为普通双列直插。举例 MAX202CPE、CPE 普通 ECPE 普通带抗静电保护MAX202EEPE 工业级抗静电保护（-45-85） 说明 E 指抗静电保护MAXIM 数字排列分类 1 字头 模拟器 2 字头 滤波器 3 字头 多路开关 4 字头 放大器 5 字头 数模转换器 6 字头 电压基准7 字头 电压转换 8 字头 复位器 9 字头 比较器DALLAS 命名规则例如 DS1210N.S. DS1225Y-100INDN=工业级 S=表贴宽体 MCG=DIP 封Z=表贴宽体 MNG=DI
44、P 工业级IND=工业级 QCG=PLCC 封 Q=QFP下面是 MAXIM 的命名规则：三字母后缀：例如：MAX358CPDC = 温度范围P = 封装类型D = 管脚数温度范围：C = 0 至 70 （商业级）I = -20 至 +85 （工业级）E = -40 至 +85 （扩展工业级）A = -40 至 +85 （航空级）M = -55 至 +125 （军品级）封装类型：A SSOP(缩小外型封装)B CERQUADC TO-220, TQFP(薄型四方扁平封装)D 陶瓷铜顶封装四字母后缀：例如：MAX1480ACPIA = 指标等级或附带功能C = 温度范围P = 封装类型I = 管
45、脚数管脚数：A: 8 B: 10，64C: 12，192 D: 14E: 16 F: 22，256G: 24 H: 44I: 28 J: 32K: 5，68 L: 40M: 7，48 N: 18O: 42 P: 20Q: 2，100 R: 3，84S: 4，80 T: 6，160U: 60 V: 8（圆形）W: 10（圆形） X: 36Y: 8（圆形） Z: 10（圆形）E 四分之一大的小外型封装F 陶瓷扁平封装H 模块封装, SBGA(超级球式栅格阵列, 5x5 TQFP)J CERDIP (陶瓷双列直插)K TO-3 塑料接脚栅格阵列L LCC (无引线芯片承载封装)M MQFP (公制四
46、方扁平封装)N 窄体塑封双列直插P 塑封双列直插Q PLCC (塑料式引线芯片承载封装)R 窄体陶瓷双列直插封装(300mil)S 小外型封装T TO5,TO-99,TO-100U TSSOP,MAX,SOTW 宽体小外型封装（300mil）X SC-70（3 脚，5 脚，6 脚）Y 窄体铜顶封装Z TO-92，MQUAD/D 裸片/PR 增强型塑封/W 晶圆 DSP 信号处理器 放大器工业用器件 通信 电源管理 移动通信视频/图像处理器等 模拟 A/D D/A 转换器 传感器 模拟器件AD 产品以“AD” 、 “ADV”居多，也有“OP”或者“REF” 、 “AMP”、 “SMP”、 “SS
47、M”、 “TMP”、 “TMS”等开头的。后缀的说明：1、后缀中 J 表示民品（0-70） ，N 表示普通塑封，后缀中带 R 表示表示表贴。2、后缀中带 D 或 Q 的表示陶封，工业级（45-85） 。后缀中 H 表示圆帽。3、后缀中 SD 或 883 属军品。例如：JN DIP 封装 JR 表贴 JD DIP 陶封 DSP 信号处理器等嵌入式控制器 高性能运放 IC 存储器 A/D D/A 模拟器件转换接口 IC 等 54LS 军品系列 CD4000 军品系列 工业 / 民用电表微控制器等TI 产品命名规则：SN54LS/HC/HCT/或 SNJ54LS/HC/HCT 中的后缀说明：1、 SN 或 SNJ 表示 TI 品牌2、 SN 军标，带 N 表示 DIP 封装，带 J 表示 DIP（双列直插） ，带 D 表示表贴，带 W 表示宽体3、 SNJ 军级，后面代尾缀 F 或/883 表示已检验过的军级。CD54LS/HC/HCT：
