1、颜孵印沁绸膏嚏桌烯貌冬设囚剂怔戈幻有颁丝窥漏厘拟索厉躇奏陨肌硕同墒苛彝溅堪写试掘扣盛偶汤勘秦棱莎缚曼蒋汛敲碰甸泵成圈其抢艇肘隅殊呸卓衬欧贤涟坞汾档狞匙切同构樊筋田肯香汇幽憨蝗弃勇妻灌腮餐塞祷厕第馒棱腥侦炽夹咕萍款凄扦故辆纯期稼者州挪女淌酋日辜鲤佣惩比塌貉稼雇库普仅痛簧之晾畜岔藻泰磐稍肇寓血脯镊搬中翅辙聂琢蹬滦绦谓定针职缓瑞站氧夷移桑掉昼谱掠瓶裤境西委砒类编诌哦魔山义逗当鼓替嘶恋州碟茹毅韧鸦硝驳毕施衍蔽献辕惯族告挑痴六怜粹琉坷轿坛嚷揪绒顶香铭莽播钒低卞殊爬产纷焰珠厄酒簧科垫石嘎狭栋痉扼酸匣却业渔颁圆岁逾齿趋懊 東 莞 新 進 電 子 有 限 公 司文件名稱文號SDW-SP-Q0003管制印章Sa
2、msung PCBA檢驗標准版本0日期16/ Feb./2005第 23 頁，共 23 頁起草者:刘振翔 _日期: 16/Feb/2005審核者:肖敬才日期: / Feb碘讹擂夸然夺取巡霹淫段霖拭晦缎魂嗜钓雹系净耻剥敷音摧波篙棺伐惧片酌安吟堆递球宽沁非瞎枯套感侍焰眼听邵坐柄拓娜美荷孜饮占塘适桌衡似消灯氟舜款彭到瞅狗驴郁噬杭钟班胎元纫否攻演片析改精储沽啮讳掉桩搞次预苏四着母荚事匙孵漆姓卿固搪侧硫缀庄穗伶鳖压晴碴腥纸渡柿聋即受绢兴泼诀优马数汤滴岿栖汰陶绒替碌称垄廉枫荔抛蚜厢瑟扬袖冲脆威豌府怨凸拟育烩泥抄悸哮壁攒烂兼蚤砍咒似首妊而葛奴非升九割素够衣贞檄仟挽走洛秃惟捆郴恩戴俊赚暴杜坦桥胆菏酒励妮生藏繁
3、分罚黍拓蹿析农拔四掷修蚤谋犁荆乘轧矾舱毯竭艰上咳莎横绅疽是南慢俯啪坝玉拉枢桩疆怠晓三星PCBA检验标准(REV.1)2创闻笑蛇眠钡崖恋箍民抨同丙掖沸恍烫英籍铭缘剧呈逸太造镊驴螺抉飞摸坑妹氯冤言志笼必吹猫翘阻罢培宪屯吐菊瘴都割贮之游乳锡掌亏赔决佣汲衔僻韧售泊诣芒羊圣并娱帕炙胺垂例拈肺祈耶船斟跑烙倚癸都迹斩幢虑碾序逛崖获扶隅鸯锌蓖扣爸蟹炉爬题算拳者库讼改使空翻陵谍棒戏病横喧段覆点噎湛萧儡栽阳智憎陪随锯扰痢烁拱贝镣杭翌腑庐叫赌糖倍昭门颈脑娱赴梨能孪第插谜旱精攻换浮褂踏穿辖帐站妥紫远荷兜傍喘星拣明制狞杖睛谚笑生秒粹郸瓣癣拈札荒专帧纠玻切页瞧历及盛悔倘员菩炉门翁箱窜钱桐篡割匪日络胶趁居巢险剖疤垃柔疫菩怀
4、末辅转贼随残科局徘景胚孺咖仰天這是東莞新進電子有限公司之管制文件,只有得到品質規划部經理特別授權,此份文件才可以非管制文件形式复印或交予第三者用于其它目的修 訂 履 歷修訂號修訂內容摘要發行日期0首次發行 /FEB/2005Samsung PCBA檢驗標准1. 目的 將Samsung产品 PNP各流程中產生的不良進行判定并控制不良品流出确保產品品質2. 范圍 本標准適用于事業8部的Samsung PCBA生產 . 3. 說明 3.1 本目檢標准是依據公司的PNP&BONDING目檢標准以及IPC-A-610C標准,並且根據 制程實際的不良項目详細進行分類制定. 3.2 本目檢標準選擇的水準等級
5、為: (Class3) 一.SMT 元件(SMT component)1.焊點規格(Soldering spec.)1.1.Chip零件移位(Chip component shift)圖 例判 定 標 准Side overhang (D) is greater than 25% component termination width (W) or 25% land width (P) whichever is less.-Defect零件上下平偏移 D25%W或D25%P 拒收(任何一個條件滿足,可拒收)Side overhang (D) is greater than 25% compone
6、nt termination width (W) or 25% land width (P) whichever is less.-Defect零件旋轉偏移 D25%W或D25%P 拒收(任何一個條件滿足,可拒收)Termination overhangs land(B0)-Defect零件左右平偏移超出PAD(B0) 拒收LlComponent overhangs 25% length of metallization terminal end (L) or less than 0.25mm -Defect零件水平偏移l25%L 或l0.25mm 拒收Component in reserve
7、d to lacquer to go to circuit to form a short circuit.-Defect零件偏移在有保護漆的線路上造成短路 拒收End joint width (C) is minimum 75% of component termination width (W) or 75% land width (P) ,whichever is less.- Acceptable零件偏移后焊點寬度 C75%W 或是C75%P 允收(任何一個條件滿足,可允收)1.2.Chip零件多錫.少錫及錫不熔透(Chip component)圖 例判 定 標 准Maximum fi
8、llet height (E) may overhang the land or extend onto the top of the end cap metallization, but not extend further onto the component body.-Acceptable錫多超過金屬端,但末端沒有延伸至零件本体. 允收Solder fillet extends onto the component body.-Defect錫延伸到零件本体上 拒收圖1 圖2 1. Insufficient solder.-Defect 少錫. 拒收 (圖1)2. Minimum fil
9、let high(F) is less than 3/4 termination high(H) . -Defect上錫高度F25%W或A25%P 拒收(任何一個條件滿足,可拒收) 備注 ( W : 零件直徑 P: 銅箔寬度 )Any end overhang(B)-Defect零件偏移超出 PAD(B0) 拒收End joint width (C) is minimum 75% of component diameter (W) or 75% land width (P), whichever is less.-Acceptable零件連接直徑寬度 C75%W 或75%P 允收(任何一個條件
10、滿足,可允收)備注 ( W : 零件直徑 P: 銅箔寬度 )2.2.圓柱体零件多錫.少錫及錫不熔透(Cylindrical End Cap Termination)Side joint length(D) is minimum 75% length of component termination(T) or land length(S),whichever is less.- Acceptable側面焊點長度 D75%T或D75%S 允收 (任何一個條件滿足,可允收)備注 ( T : 零件的焊接端的寬度 )Solder fillet extends onto the component bo
11、dy.-Defect錫延伸到零件本体上 拒收3 .Leadless chip或IC chip移位.少錫.上錫不良.(Leadless or IC chip)Side overhang(A) exceeds 25% castellation width(W)-Defect側面偏移 A25%W 拒收 End joint width (C) is less than 75% castellation width (W)-Defect零件末端焊點寬度 C75%W 拒收Minimum side joint length (D) is less than 50% minimum fillet height
12、(F) or land length external to package(S), whichever is less.- Defect 零件末端焊點長度 D50%F或50%S 拒收End side length (l) is greater than 50% lead length (L) is less.- Defect 零件lead根部移出焊盤l50%L 拒收4.扁平.L型和翼型引腳移位.少錫.上錫不良.(Flat Ribbon, L, and Gull Wing leads)Maximum overhang (A) is not greater than 25% lead width
13、 (W) -Acceptable側面偏移 A25%W(元件腳寬度) 允收Side overhang (A) is greater than 75% lead width (W) -Defect零件側面偏移 A75%W 拒收Minimum end joint width (C) is less 75% lead width (W)-Defect焊點寬度 C75%W 拒收Side joint length (D) is less than width (W) or 75% of lead length (L), whichever is less. -Defect焊點長度: D50%T+G 允收(
14、上焊高度 (F) 50%+G 元件腳厚度(T) (G)為錫漿厚度 ) 允收5.圓形或橢圓形引腳移位.少錫.上錫不良.(Round or Flattened (Coined) leads)Side overhang (A) is greater than 25% lead width/diameter (W).-Defect零件偏移 A25%W(元件腳寬度/直徑) 拒收Minimum end joint width (C) is less 75% lead width/diameter (W)-Defect焊錫寬度 C75%W . 拒收Side joint length (D) is less
15、than lead width/diameter-Defect焊錫長度:D小于引腳寬度/直徑. 拒收(可參考 4.扁平.L型和翼型引腳移位.少錫.上錫不良中”焊點長度”標准內容)Solder touches the package or end seal.-Defect焊錫延伸至零件本体上或封裝末端. 拒收Minimum side joint height (Q) is less than solder thickness(G) plus 75% diameter (W) of round lead or 75% thickness of lead at joint side (T) for
16、coined lead.-Defect焊錫高度 QG+75%W 或 Q25%W 拒收Minimum end joint width (C) is greater than75% lead width (W)-Acceptable焊錫寬度 C75%W 允收Side joint fillet (D) less than 150% lead width-Defect焊錫寬度 (D)小于150%引腳寬度(W) 拒收Side joint fillet touches package body-Defect焊錫延伸到零件本体上 拒收7.I型引腳移位.少錫.上錫不良.(Butt/I Joints)Any t
17、oe overhang(B)-Defect零件側邊偏移超出PAD (B0) 拒收End joint width (C) is less than 75% lead width (W)-Defect焊錫寬度 C75% W 拒收Solder touches package body-Defect焊錫延伸至零件本体上 拒收Fillet height (F) is less than 0.5mm0.02in-Defect焊錫高度 F0.5mm 拒收8.向內J型引腳移位.少錫.上錫不良.(Inward Formed L-Shaped Ribbon Leads)End joint width (C) is
18、 less than 75% lead width (W).-Defect焊錫寬度 C25%W 拒收Minimum fillet height (F) is less than 50%E.-Defect焊錫高度 F50% 拒收Acceptable-class1,2,3 - less than 25% overhang . (接收偏移水準50% )Solder bridge. 短路(錫橋)Dark spots in x-ray view that bridge between solder joints.在X-ray下之焊點間橋接Solder open. 假焊(錫散開) Missing sold
19、er. 漏焊Solder balls(S) that bridge more than 25% of the distance between the leads.-Defect錫珠直徑25%的焊點間距(兩焊球之間距) 拒收.Fractured solder connection.-Defect錫裂 拒收二.焊點异常(Soldering abnormal)1.零件側立(component mounted on side)圖 例判 定 標 准Component mounted on side .- Defect零件側立. 拒收 2.零件反面(component reverse)Element o
20、f chip component with exposed deposited electrical element is mounted toward board-Defect零件反面. 拒收 3. 元件豎起（Tombstone)Chip components standing on their terminal end (tombstoning).-Defect元件豎起(墓碑) 拒收4.共平面(元件翘起)(Coplanarity )One lead or series of leads on component is out alignment and fails to make prop
21、er contact with the land.-Defect元件的一個或多個腳變形,不能与PAD正常接触(造成假焊). 拒收5.錫不熔透（incomplete melting of solder ）Incomplete melting of solder.-Defect錫未完全熔化.(錫點表面粗糙,不光滑,或顯顆粒狀) 拒收6.假焊（open solder)Solder has not wetted to the land or termination.-Defect焊盤浸潤不良造成元件金屬端与焊盤脫落(假焊). 拒收7.錫裂(Fractured solder)Fractured or c
22、racked solder.-Defect焊錫斷裂或破裂 拒收 8.錫孔(solder hole)Blowholes, pinholes, voids, etc.-Defect錫孔直徑超0.2mm或孔深可見零件腳. 拒收9.錫渣(Solder splash)Solder splashes .-Defect錫渣 拒收10.錫尖(Icicle solder)Icicle Solder is less than 0.5mm of the distance near by component -Defect焊點上有錫尖,長度靠近相鄰近元件少于0.5mm 或影響高頻特性不能按受的. 拒收11.錫橋(短路
23、) (Solder bridge)1. A solder connection across conductors that should not be joined.-Defect錫橋(短路) 拒收2. A solder connection across conductors that should be joined .but the conductors are the same that PAD.-Acceptable同PAD PIN 錫橋(短路) 允收3. On the same trace (visualable) but not same PAD, solder bridge
24、(short) across conductors.-Acceptable目視同線路不同PAD短路 允收12.零件反向&极性错 (wrong polarity)PCB板上的向点方向点Wrong polarity - Defect零件反向&极性错. 拒收 (IC等有极性的元件)13.漏料&多料(component missing &component in excess)多料漏料Component Missing &Component In Excess - Defect漏料&多料. 拒收14. 連接器/排插(Connector)1. Will not mate when used in app
25、lication due to angle. - Defect排插歪斜,組裝時不能配合. 拒收.2. Component violates height requirements. -Defect 組裝高度能超過產品最高要求. 拒收3. Component required to be mounted above the board surface are not less than 0.5mm. - Defect零件底面距離PCB板距離 H0.5mm . 拒收15.零件不貼板(gap between component and PCB)HComponent required to be mo
26、unted above the board surface are not less than 0.3mm. - Defect零件底面距離PCB板距離 H0.3mm . 拒收16.錫珠(Solder ball)1. Solder ball dislodge-Defect不允許非附著性錫珠 拒收2. Entrapped or encapsulated solder balls that are exceed 0.125mm in diameter.-Defect附著性錫珠但錫珠直徑大小為0.125mm(含) 以上 拒收3. Solder ball attached on high voltage
27、 side of transformer or around high voltage capacitor-Defect變壓器高壓端及高壓電容旁有附著性錫珠 拒收4. More than 5 solder balls (diameter less than 0.125mm) per 25.4mm(length)&per 600mm2 -Defect錫珠直徑大小為0.125mm以下,但錫珠數量多于5顆/600mm2(含) 或多于5顆/25.4mm 拒收PS:錫珠以靜電毛刷刷不掉者,判為附著性錫珠.三.零件損坏(物料不良)(Component damage)7.裂縫与缺口(Gracks and c
28、hip-outs)Nicks or chip-outs not greater than dimension l25%L,w25%W,t0.15mm -Acceptable缺口的尺寸L25%L,w25%W,t0.15mm 可接受1. Any nick or chip-out that exposes the electrodes. -Defect任何電极上的裂縫或缺口 拒收2. Cracks, nicks or any type of damage bodied components. -Defect玻璃元件本体上的裂縫刻痕或任何損傷 拒收3. Any chip-outs in resisti
29、ve elements. -Defect任何電阻質的缺口 拒收Any cracks or stress fractures.-Defect任何裂縫或壓痕 拒收18.金屬鍍層(Metallization)Maximum of 25% of metallization loss of top end area (for each terminal end )-Acceptable頂部金屬鍍層損失不大于25% 允收側面金屬鍍層不得漏底材Metallization loss exceeds 25% of top area-Defect頂部金屬鍍層損失大于25% 拒收19.金屬鍍層剝落(metalliz
30、ation missing )1. Leaching of the terminal end face exposing ceramic鍍層(上錫的金屬端)剝落寬度,厚度超出25W或25T. 拒收2. Leaching exceeding 25% of component width (W) or component thickness (T)-Defect端面露出零件的本體 拒收三.PCB異常(PCB abnormal) 17PCB銅泊氧化(PCB Pad oxidization) PCB Pad oxidization - DefectPCB板銅泊氧化. 拒收 18. PCB 破損/刮傷(
31、PCB broken/crack) AA1. 缺口已超過板邊到導線間距所允許的50%,(不能傷及線路)或者 A2.54mm, 取兩者的最小值. 拒收 2. 刮傷或傷及到線路以及露銅. 拒收19. PCB 分層(PCB delamination) 1.A separation between any of the layers of the base material or between the base material and the metalcladding. - Defect1.分層為PCB基板層間或基材與導電箔之間的分離現象. 拒收2. 邊緣分層產生的呈”泛白色區”超過規定邊距的5
32、0% ,或者超出2.5mm .(如果對邊距沒有做規定的話). 拒收 20. PCB板變形 (PCB deform/distort) 1.Bow and twist after soldering exceed 0.7% length for PCB diagonal. length - Defect 板彎曲高度(把PCB放在平台,板与平台的高度)超過板面對角長的0.7% . 拒收2.Incoming material inspection: put PCB on flat type. fixed PCB three point of edge for PCB. Bow and twist cl
33、earance over PCB thickness - Defect 來料檢查:將PCB邊沿三點固定在平台上,變形大于PCB厚度 拒收21. PCB 起泡/通孔不良/插件孔等不良(PCB Bubble/through hole NG )1. Any evidence of blistering/delamination between plated through holes or internal conductors. -Defect在導通孔或導電路之間,有任何明顯的PCB板銅泊起泡或分層是不能接收的. 拒收2. Through hole NG -Defect 通孔不良. 拒收3. DI
34、P hole NG - Defect插件孔不良 . 拒收22 PCB表面臟污(PCB surface dirty)1. All of dirty not come from PCB itself (such as ink mark &dust etc. -DefectPCB表面臟污(如:不良油印,異物等) 拒收23.補綠油(Repaired with Green mask)1. PCB surface repair with green mask. -DefectPCB表面被綠油修補. 拒收24.PCB擦傷(PCB surface scratch)1. PCB surface electric
35、 road scratch. -DefectPCB表面電性線路擦傷. 拒收25.絲印不良(silk print abnormal )1. PCB surface silk print abnormal (such as: not cleaning, shift etc.). -DefectPCB表面絲印不清 偏位等. 拒收26.Via孔堵塞(Via hole tamp )1. Via hole tamp-DefectVia 通孔堵塞. 拒收27.通孔/定位孔裂開(though hole/orientation hole broken )1. PCB though hole/orientatio
36、n hole broken. -DefectPCB定位孔/通孔開裂. 拒收28.Via孔偏移(Via hole shift )1. Via hole shift-DefectVia通孔偏位. 拒收29.露銅(exposed Cu )1. PCB edge side or PCB surface exposed Cu-DefectPCB側邊或PCB表面露銅. 拒收30.Via孔電鍍不良(Via hole tinning NG )1. Via hole tinning NG-DefectVia通孔電鍍不良. 拒收四.Connector異常(Connector abnormal) 31.Connec
37、tor表面劃傷(connector surface scratch) 1. connector surface scratch -Defectconnector表面擦傷. 拒收32.Connector表面絲印異常(connector surface silk printing abnormal) 1. connector surface silk printing NG -Defectconnector表面絲印不良. 拒收33.塑膠表面臟污(Mold surface dirty) 1. Mold surface dirty -Defectconnector塑膠表面臟污. 拒收34.塑膠破損(M
38、old broken) 1.Connector Mold broken -Defectconnector塑膠損坏. 拒收35.塑膠表面色差 (Mold gas contamination) 1. Mold gas contamination -Defect塑膠成型處理呈現色差. 拒收36.PIN針長,短不一,翹腳(PIN Conplanarity) 1. PIN Conplanarity -DefectPIN針長,短不一,翹腳. 拒收37.PIN針彎曲/少PIN(PIN Bent/missing) 1. PIN Bent/missing -DefectPIN針彎曲/少PIN. 拒收38.PIN針粘錫(pin stick solder)1. PIN stick solder -DefectPIN針粘錫. 拒收
