1、,電路板(PCB)字彙整理,教 育 訓 練 教 材,僅 供 內 部 使 用 嚴 禁 翻 印 (2000.06.07),PCB字典,流 程 圖 PCB Mfg. FLOW CHART,UPDATED:1999,09,01,多層板內層流程 (INNER LAYER PRODUCT),P1/136,* Process Module 說明 :A. 下料 ( Cut Lamination) a-1 裁板 ( Sheets Cutting) a-2 原物料發料 (Panel)(Shear material to Size)B. 鑽孔 (Drilling) b-1 內鑽 (Inner Layer Drill
2、ing ) b-2 一次孔(Outer Layer Drilling ) b-3 二次孔 (2nd Drilling) b-4 雷射鑽孔 (Laser Drilling )(Laser Ablation ) b-5 盲(埋)孔鑽孔 (Blind & Buried Hole Drilling)C. 乾膜製程 ( Photo Process(D/F) c-1 前處理 (Pretreatment) c-2 壓 膜 (Dry Film Lamination) c-3 曝 光 (Exposure) c-4 顯 影 (Developing) c-5 蝕銅 (Etching) c-6 去膜 (Strippi
3、ng) c-7 初檢 ( Touch-up) c-8 化學前處理,化學研磨 ( Chemical Milling ) c-9 選擇性浸金壓膜 (Selective Gold Dry Film Lamination) c-10 顯 影(Developing ) c-11 去膜(Stripping )D. 壓 合 Lamination d-1 黑 化 (Black Oxide Treatment) d-2 微 蝕 (Microetching),Developing , Etching & Stripping ( DES ),d-3 鉚釘組合 (eyelet ) d-4 疊板 (Lay up) d-
4、5 壓 合 (Lamination) d-6 後處理 (Post Treatment) d-7 黑氧化 ( Black Oxide Removal ) d-8 銑靶 (spot face) d-9 去溢膠 (resin flush removal)E. 減銅 (Copper Reduction) e-1 薄化銅(Copper Reduction)F. 電鍍 (Horizontal Electrolytic Plating) f-1 水平電鍍 (Horizontal Electro-Plating) (Panel Plating) f-2 錫鉛電鍍 ( Tin-Lead Plating ) (P
5、attern Plating) f-3 低於 1 mil ( Less than 1 mil Thickness ) f-4 高於 1 mil ( More than 1 mil Thickness) f-5 砂帶研磨 (Belt Sanding) f-6 剝錫鉛 ( Tin-Lead Stripping) f-7 微切片 ( Microsection)G. 塞孔 (Plug Hole) g-1 印刷 ( Ink Print ) g-2 預烤 (Precure) g-3 表面刷磨 (Scrub) g-4 後烘烤 (Postcure)H. 防焊(綠漆): (Solder Mask) h-1 C面
6、印刷 (Printing Top Side) h-2 S面印刷 (Printing Bottom Side) h-3 靜電噴塗 (Spray Coating) h-4 前處理 (Pretreatment) h-5 預烤 (Precure) h-6 曝光 (Exposure) h-7 顯影 (Develop) h-8 後烘烤 (Postcure),h-9 UV烘烤 (UV Cure) h-10 文字印刷 ( Printing of Legend ) h-11 噴砂 ( Pumice)(Wet Blasting) h-12 印可剝離防焊 (Peelable Solder Mask)I . 鍍金 G
7、old plating i-1 金手指鍍鎳金 ( Gold Finger ) i-2 電鍍軟金 (Soft Ni/Au Plating) i-3 浸鎳金 ( Immersion Ni/Au) (Electroless Ni/Au)J. 噴錫 (Hot Air Solder Leveling) j-1 水平噴錫 (Horizontal Hot Air Solder Leveling) j-2 垂直噴錫 ( Vertical Hot Air Solder Leveling) j-3 超級焊錫 (Super Solder ) j-4. 印焊錫突點 (Solder Bump)K. 成型 (Profil
8、e)(Form) k-1 撈型 (N/C Routing ) (Milling) k-2 模具沖 (Punch) k-3 板面清洗烘烤 (Cleaning & Backing) k-4 V型槽 ( V-Cut)(V-Scoring) k-5 金手指斜邊 ( Beveling of G/F)L. 短斷路測試 (Electrical Testing) (Continuity & Insulation Testing) l-1 AOI 光學檢查 ( AOI Inspection) l-2 VRS 目檢 (Verified & Repaired) l-3 汎用型治具測試 (Universal Test
9、er) l-4 專用治具測試 (Dedicated Tester) l-5 飛針測試 (Flying Probe)M. 終檢 ( Final Visual Inspection) m-1 壓板翹 ( Warpage Remove) m-2 X-OUT 印刷 (X-Out Marking) m-3 包裝 及出貨 (Packing & shipping),m-4 目檢 ( Visual Inspection) m-5 清洗 及烘烤( Final Clean & Baking) m-6 護銅劑 (ENTEK Cu-106A)(OSP) m-7 離子殘餘量測試 (Ionic Contamination
10、 Test )(Cleanliness Test) m-8 冷熱衝擊試驗 (Thermal cycling Testing) m-9 焊錫性試驗 ( Solderability Testing )N. 雷射鑽孔(Laser Ablation) N-1 雷射鑽Tooling孔 (Laser ablation Tooling Hole) N-2 雷射曝光對位孔(Laser Ablation Registration Hole) N-3 雷射Mask製作(Laser Mask) N-4 雷射鑽孔(Laser Ablation) N-5 AOI 檢查及VRS ( AOI Inspection & Ve
11、rified & Repaired) N-6 Blaser AOI (after Desmear and Microetching) N-7 除膠渣 (Desmear) N-8 微蝕 (Microetching ),A/W (artwork) 底片Ablation 燒溶(laser),切除abrade 粗化abrasion resistance 耐磨性absorption 吸收ACC ( accept ) 允收accelerated corrosion test 加速腐蝕accelerated test 加速試驗acceleration 速化反應accelerator 加速劑acceptabl
12、e 允收activator 活化液active work in process 實際在製品adhesion 附著力adhesive method 黏著法air inclusion 氣泡air knife 風刀amorphous change 不定形的改變amount 總量amylnitrite 硝基戊烷analyzer 分析儀anneal 回火annular ring 環狀墊圈;孔環anode slime (sludge) 陽極泥anodizing 陽極處理AOI ( automatic optical inspection )自動光學檢測applicable documents 引用之文件A
13、QL sampling 允收水準抽樣aqueous photoresist 液態光阻aspect ratio 縱橫比(厚寬比)As received 到貨時,back lighting 背光back-up 墊板 banked work in process 預留在製品base material 基材baseline performance 基準績效batch 批beta backscattering 貝他射線照射法beveling 切斜邊;斜邊biaxial deformation 二方向之變形black-oxide 黑化blank controller 空白對照組,blank panel 空
14、板blanking 挖空blip 彈開blister 氣泡;起泡blistering 氣泡blow hole 吹孔board-thickness error 板厚錯誤bonding plies 黏結層bow ; bowing 板彎break out 從平環內破出bridging 搭橋;橋接BTO (Build To Order) 接單生產burning 燒焦burr 毛邊(毛頭)camcorder 一體型攝錄放機carbide 碳化物carlson pin 定位梢carrier 載運劑catalyzing 催化catholic sputtering 陰極濺射法caul plate 隔板;鋼板c
15、alibration system requirements 校驗系統之各種要求center beam method 中心光束法central projection 集中式投射線certification 認證chamfer 倒角 (金手指)chamfering 切斜邊;倒角characteristic impedance 特性阻抗charge transfer overpotential 電量傳遞過電壓chase 網框checkboard 棋盤chelator 蟹和劑chemical bond 化學鍵chemical vapor deposition 化學蒸著鍍circumferential
16、 void 圓周性之孔破clad metal 包夾金屬clean room 無塵室clearance 間隙coat 鍍外表coating error 防焊覆蓋錯誤,coefficient of thermal expansion (CTE) 熱澎脹系數cold solder joint 冷焊點cold-weld 金屬粉末冷焊color 顏色color error 顏色錯誤compensation 補償competitive performance 競爭力績效complex salt 錯化物complexor 錯化物component hole 零件孔component side 零件面conc
17、entric 同心conformance 密貼性consumer products 消費性產品contact resistance 接觸電阻continuous performance 連續發揮效能contract service 協力廠controlled split 均裂式conventional flow 亂流方式conventional tensile test 傳統張力測試法conversion coating 轉化層convex 突出coordinate list 資料清單copper claded laminates (CCL) 銅箔基板copper exposure 線路露銅c
18、opper mirror 鏡銅copper pad 銅箔圓配copper residue (copper splash) 銅渣corrosion rate numbering 腐蝕速率計數系統corrosion resistance 抗蝕性coulombs law 庫倫定律countersink 喇叭孔coupon 試樣coupon location 試樣點covering power 遮蓋力CPU 中央處理器crack 破裂;裂痕crazing 裂痕;白斑cross linking 交聯聚合,cross talk 呼應作用crosslinking 交聯crystal collection 結
19、晶收集curing 聚合體current efficiency 電流效率cut-outs 挖空cutting 裁板cyanide 氰化物cycles of learning 學習循環cycle-time reduction 交期縮短date code 週期deburring 去毛頭dedicated 專用型degradation 退變delamination 分層dent / pin hole 凹陷 / 針孔department of defense 國防部designation 字碼簡示法de-smear 除膠渣developing 顯影dewetting 縮錫dewetting time
20、縮錫時間dimension error 外形尺寸錯誤dielectric constant 介質常數difficulty 困難度difunctional 雙功能dimension 尺寸dimension stability 尺寸安定性dimensional stability 尺度安定性dimension and tolerance 尺寸與公差dirty hole 孔內異物discolor hole 孔黑;孔灰;氧化discoloration 變色disposable eyelet method 消耗性鉚釘法distortion factor 尺寸變形函數double side 雙面板,dow
21、ntime 停機時間drill 鑽孔drill bit 鑽頭drill facet 鑽尖切萷面drill pointer 鑽尖重(研)磨機drilled blank board 已鑽孔之裸板drilling 鑽孔dry film 乾膜ductility 延展性economy of scale 經濟規模edge spacing 板邊空地edge-board contact ( gold finger ) 金手指efficiency 能量效率electric test 電測electrical testing 電測;測試electrochemical machine ECM 電化學加工法elect
22、rochemical reactor 電化學反應器electroforming 電鑄electroless plate 化學銅electroless-deposition 無電鍍electropolishing 電解拋光electrorefining 電解精鍊electrowinning 電解萃取elliptical set 橢圓形embrittlement 脆性entitlement performance 可達成績效entrapment 電鍍夾雜物epoxy 環氧樹酯equipotential 電位線error data file 異常情形etch rate 蝕銅速率etchants 蝕刻
23、液etchback 回蝕evaluation program 評估用程式exposure 曝光external pin method 外部插梢法eyelet hole 鉚釘孔Eyeletting 鉚眼fabric 網布failure 故障,fast response 快速回應fault 瑕庛;缺陷fiber exposure 纖維顯露fiber protrusion 纖維突出fiducial mark 光學點,基準記號filler 填充料film 底片filtration 過濾finished board 成品fixing 固著fixture 電測夾具(治具)flaking off 粹離fla
24、mmability rating 燃性等級flare 喇叭形孔flat cable 併排電纜feedback loop 回饋循環first-in-first-out (FIFO) 先進先出flexible manufacturing system (FMS) 彈性製造系統flux 助焊劑foil distortion 銅層變形fold 空泡foreign include 異物foreign material 基材內異物free radical chain polymerization 自由基連鎖聚合fully additive 加成法fully annealed type 徹底回火軔化之類形function 函數fundamental and basic 基本fungus resistance 抗黴性funnel flange 喇叭形摺翼galvanized 加法尼化製程gap 鑽尖分開gauge length 有效長度gel time 膠化時間general resist ink 一般阻劑油墨general 通論general industrial 一般性(電子)工業級geometrical levelling 幾何平整glass transition temperature (Tg) 玻璃態轉換溫度,
