.Siliconingot 硅锭Wafer晶片Mirror wafer 镜面晶圆Patter 晶圆片FAB： fabrication 制造Fabrication Facility 制造wafer生产工厂Probe test 探针测试Probe card 探针板Contact 连接Probe Tip 探头端部ChipFunction 功能EPM： Electrical Parameter MonitoringSummary 总结R&D：Research and Development 研究和开发MCP：Multi Chip Package 多芯片封装POP：Package on Packagee-MMC：embedded Multi Media card 嵌入式多媒体卡WLP：Wafer Level Package 晶圆级封装SDP 一层DDP 两层QDP 四层ODP 八层Pad outBack Grind 背研磨Wafer Grind Back Grind 磨片Overview
