.常见封装形式简介DIP = Dual Inline Package = 双列直插封装HDIP = Dual Inline Package with Heat Sink = 带散热片的双列直插封装SDIP = Shrink Dual Inline Package = 紧缩型双列直插封装SIP = Single Inline Package = 单列直插封装HSIP = Single Inline Package with Heat Sink = 带散热片的单列直插封装SOP = Small Outline Package = 小外形封装HSOP = Small Outline Package with Heat Sink = 带散热片的小外形封装eSOP = Small Outline Package with exposed thermal pad = 载体外露于塑封体的小外形封装 SSOP = Shrink Small Outline
