微电子工艺原理.doc

微电子工艺原理 1、 单项选择 1. The most common reticle reduction ratio used with step-and-scan exposure tools is（ D ） a.1:1 and 4:1 b. 1:1 and 5:1 c.4:1 and 5:1 d.4:1 2. Which of the following processes are performed in the diffusion area? Circle all that apply. （ B ） a. wafer cleans b.high temperature processing c.metallization d.polishing e.photoresist stripping 3. What are the three production areas where photoresist-coated w