一、专业术语1. PWB（Printed wire board）;PCB（Printed Circuit Board）;RIGID PCB（刚性印制板）;FLEX PCB（挠性印制板）;FLEX-RIGID PCB（刚挠印制板）2. Tg (glass transition temperature, Tg)玻璃转化温度；(P18)3. PTH (Plated Through Hole)孔金属化；(P100)4. LDI（Laser Direct Imaging）激光直接成像5. CCL (Copper clad laminate) 覆铜箔层压板； FCCL(Fecible)挠性覆铜板 (P11)6. HASL（Hot Air Solder Level)喷锡 (P215)7. BGA （Ball Grid Array）球栅阵列8. FPC （Flexible Printed Circuit）柔性印刷电路板 （P316）9. PI；PET；EP；BT聚酰亚胺；聚酯树脂；环氧树脂；双马来酰亚胺三嗪树脂（P14P15）10. CTE（C
