微波毫米波系统级封装中键合线建模孙一超 胡静 钱学军摘要：在系统级封装中，存在微波及高速电路，如果没有考虑互连线对电路性能的影响，可能会导致最终的电路不能满足设计要求。本文利用3维电磁场仿真软件HFSS分析单根键合线的电磁特性，建立单根键合线的电路模型，并研究不同参数下键合线在电磁特性方面的区别。关键词：键合线 HFSS 等效电路 Bond-Wire Modeling in Microwave Millimeter Wave System-Level PackageAbstract: Without considering the influence of the interconnection line on the electric circuit performance in system-level package, the final electric circuit may not to be able to satisfy the design requirements for the existence of microwave an
