1、电子英语证书考试(PEC)-电子工程术语AA Symbol for ampere.abstract To simplify.ABT Acronym for Advanced BiCMOS Technology, as in 74ABT245.ABTE Acronym for Advanced BiCMOS Technology/Enhanced logic, as in 74ABTE245.ABTH Acronym for Advanced BiCMOS Technology logic with bus-Hold, as in 74ABTH245.AC Acronym for Alterna
2、ting Current.AC Acronym for Advanced CMOS logic, as in 74AC245.accuracy 1. The extent to which a given measurement, or the average of a set of measurements, agrees with the true value for that measurement. 2. Agreement between simulation results and lab measurements.ACL Acronym for Advanced CMOS Log
3、ic, as in 74ACL245.ACT Acronym for Advanced CMOS logic with TTL compatible inputs.AEA Acronym for American Electronic Association.AEA Acronym for American Engineering Association.AHDL Acronym for Analog Hardware Description Language.AMS Acronym for Analog Mixed-Signal (hardware description language)
4、.analog Information represented as continuously varying voltage or current rather than in discrete levels as opposed to digital data varying between two discrete levels.ANOVA Acronym for Analysis Of VarianceANSI Acronym for American National Standards Institute.AQL Acronym for Acceptable Quality Lev
5、el.ASCII Acronym for American Standard Code for Information Interchange.ASIC Acronym for Application Specific Integrated Circuit.ASTM Acronym for American Society for Testing and Materials.AWE Acronym for Asymptotic Waveform Evaluation. Model order reduction. Such as reducing a large RC network to a
6、 smaller RC network for faster simulation. This modeling method has known frequency limits for accuracy.Bbehavioral model Provides data on behavior at the input and output ports of a device. What the device consists of internally remains a black (opaque) box. Usually used when scanning a large desig
7、n for the first time. At that point speed is desired over detail.behavioral modelingSystem-level modeling consisting of a functional specification plus modeling of the timing of an implementation. A behavioral model consists of an HDL description of a device or component, which is expressed at a rel
8、atively high level of abstraction (higher than the register-transfer level or gate level). It uses underlying mathematical equations to represent the functional behavior of the component. See alsofunctional modeling.BEM Acronym for older Boundary Element Method. Method of numerical computational ele
9、ctromagnetics. Dates from before the 1980s. Requires ground plane.BER Acronym for Bit Error Rate.BGA Acronym for Ball Grid Array.BiCMOS Acronym for Bipolar Complementary Metal Oxide Semiconductor.BIRD Acronym for Buffer Issue Resolution Document IBIS Committee.BJT Acronym for Bipolar Junction Transi
10、stor.BNC Acronym for Bayonet Neill Concelman Connector.BOM Acronym for Bill Of Materials.BSIM Acronym for Berkeley Short-channel IGFET Model.BTL Acronym for Backplane Transceiver Logic, as in 74BTL245.CC 1. Symbol for capacitance. 2. Abbreviation for degrees Celsius/Centigrade.CAD Acronym for Comput
11、er Aided Design.CAE Acronym for Computer Aided Engineering.CAM Acronym for Computer Aided Manufacturing.CB Acronym for Complementary Bipolar, as in 74CB245.CEM Acronym for Computational Electromagnetics.characteriza-tion modelAnother term for a devices data sheet. Displays the behavior of various pr
12、operties over current, frequency, temperature, population spread, etc. Characterize means to describe and depict.circuit Interconnection of components to provide an electrical path between two or more components.CISPR Acronym for Comit Internationale Spcial des Perturbations Radioelectrotechnique.CM
13、C Acronym for Compact Model Council.CML Acronym for Current Mode Logic.CMOS Acronym for Complimentary Metal Oxide Semiconductor.CMRR Acronym for Common Mode Rejection Ratio.Confidence interval A statistical range with a specified probability that a given parameter lies within the range.Confidence le
14、vel Example: Suppose an opinion poll predicted that, if the election were held today, the Conservative party would win 60% of the vote. The pollster might attach a 95% confidence level to the interval 60% plus or minus 3%. That is, he thinks it very likely that the Conservative party would get betwe
15、en 57% and 63% of the total vote.Confidence limit Either of the two numbers that specify the endpoints of a confidence interval.correlation 1. How well a set of measurements agrees with a separate set of measurements on the same group of units. One or more attributes may be used. 2. Process of makin
16、g a quantitative comparison between two sets of data. Also, from the word roots co: together and relation.correlation metric A means of quantifying agreement between two sets of data.COTS Acronym for Commercial Off-The-Shelf apparatus.CPD Acronym for Cumulative Probability Distribution (function).cr
17、osstalk The amount of signal from one conductor that gets coupled onto an adjacent conductor through the mutual capacitance and inductance between them. The magnitude of the effect is always a fraction of the active, or aggressor, net upon the passive, or victim, net. The amount of coupling depends
18、on the proximity of the nets, the proximity of any ground/power plane, the length of any parallel runs, the risetime of the driving signal and the dielectric medium between them.current carrier A current carrier is either a conduction band electron or a conduction band hole.DDARPA Acronym for Defens
19、e Advanced Research Projects Agency.data sheet Documentation created after the properties and behavior of a population of devices, from a statistically in-control process, are characterized.dB Acronym for decibel. The number of decibels denoting the ratio of the two amounts of power being ten times
20、the logarithm to the base 10 of this ratio. With P1 and P2 designating two amounts of power and n the number of decibels denoting their ratio.(ANSI C63.14 1992) N = 10log10 (P1/P2) dBdBmV/m Symbol for decibels-micro-Volts per meter. where dBmv = 20 log Signal (mV)/1mV Decibels relative to one microv
21、olt across same resistance.DC Acronym for Direct Current.detailed physical modelA device model wherein its internal detail is described as closely as possible. There is usually a close correlation with the physical construction of the device.device A component or part.DFM Acronym for Design For Manu
22、facturability.DFT Acronym for Design For Test.DIE Acronym for Die Information Exchange.dielectric Dielectric materials are poor conductors of electricity, and are insulators that are used to provide separation between conductors. Dielectric materials can be made to hold an electrostatic charge while
23、 dissipating minimal energy in the form of heat. Glass, porcelain, mica, rubber, plastics dry air, vacuums and some liquids and gases are dielectric. For example: air, FR4, and GETEK.dielectric constant (relative)An inherent property of dielectric materials that determines the amount of electric cha
24、rge that can be stored. The higher the constant, E, the higher the energy stored in the materials capacitance. E is usually measured and reported in formulas relative to air (Er). Air then gets an Er, = 1. FR4 often has a low frequency Er = 4.3 depending on starting materials and processing. In soli
25、d dielectrics Er will fall off starting with high frequencies while signal attenuation increases. Er affects transmission line behavior, particularly characteristic impedance (Zo) and propagation delay (td). The changes in td with frequency cause decreased delay leading to dispersion, or spreading d
26、istortion, of a time domain pulse that is composed of many frequencies.digital Data varying between two discrete levels. Electronic signals or switches based on discrete, binary electrical levels (ones and zeros) found in such products as touch-tone telephones and audio compact disk players. These s
27、ignals are either ON or OFF, HIGH or LOW, YES or NO. The mathematical description in digital products is simple, since it is either ON or OFF.DIP Acronym for Dual InLine Package.discrete As in discrete component. Package containing only a single component as opposed to an integrated circuit containi
28、ng many components in a single package.dispersion 1. The scattering of values of a measurement around the mean or median of the measurement.2. A distribution.dispersion, dielectric A high frequency effect in dielectric materials. At high frequencies the dielectric constant decreases causing an incre
29、ase in propagation velocity and a dispersion in arrival times of wave frequency components.DML Acronym for Device Modeling Language (Cadence) and associated .dml files.documentation Reports such as data sheets, process control, product characterization, process characterization, and models. May be p
30、roduced by either the supplier or customer to describe or depict the semiconductor process.DOE Acronym for Design Of Experiments.doping The process of adding impurity atoms to intrinsic (pure) silicon or germanium to improve the conductivity of the semiconductor material.DSP Acronym for Digital Sign
31、al Processing.DTL Acronym for Diode-Transistor Logic.DUT Acronym for Device Under Test.EEarly effect A behavior in narrow base BJT transistors named for Dr. J. Early who explained it. The effect is an increase in b due to base narrowing caused by increasing base-collector bias voltage.EBD Acronym fo
32、r Electronic Board Description (IBIS) and the associated .ebd files.ECL Acronym for Emitter Coupled Logic.EDA Acronym for Electronic Design Automation. EDA software tools or tool suites may display simulator output for analysis (as in waveform analyzers) or which may analyze the reliability, electro
33、magnetic interference, metal migration, signal integrity, or thermal characteristics of a design. The tools in this category may work at any level of abstraction behavioral, register-transfer-level (RTL), gate-level, or with the physical layout of an IC device or electronic system.EDIF Acronym for E
34、lectronic Design Interchange Format.EIA Acronym for Electronic Industries Association.EIAJ Acronym for Electronics Industries Association of Japan.EKV Acronym for Enz-Krummenacher-Vittoz model.ElectroMagnetic IntegrityThe technical discipline of designing for ElectroMagnetic Control (EMC) and low El
35、ectroMagnetic Interference (EMI), so that one circuit (or equipment) does not interfere with another circuit (or equipment). The design task begins with designing for good Signal and Power Integrity and adds the concerns of coupling and radiation. The noise energy available to the coupling and radia
36、tion mechanisms can be suppressed with good Signal and Power Integrity. The next step is good design control over coupling and radiation mechanisms. These additional actions include controlling: shielding; cabling; leakage; board resonances; enclosure resonances; structural behavior that operates as
37、 an antenna.EM Acronym for ElectroMagnetic.EMC Acronym for ElectroMagnetic Compatibility. The capability of Electrical and Electronic Systems, equipment and devices to operate in their intended electromagnetic environment within a defined margin of safety, and at design levels of performance, withou
38、t suffering or causing unacceptable degradation as a result of electromagnetic interference (ANSI C63.14 1992).EMI Acronym Electromagnetic Interference. The electromagnetic disturbances (electronic noise) in an environment that can affect an electronic device, or that which is being produced by an e
39、lectronic device, or both. EMI analysis tools are used to verify EMC compliance during the design of high-speed PCBs and IC packages. The traditional EMI remedies involve the addition of extra components, metal shields, metal plans, or even redesigning the entire system. Synonym: radio-frequency int
40、erference.EMI/EMC Acronym for Electromagnetic Interference/Electromagnetic Control.equation-based model A model based on equations that describe the behavior of the device, or circuit, modeled. Most importantly, the output as a function of the input.ESD Acronym for ElectroStatic Discharge. A transfe
41、r of electric charge between bodies of different electrostatic potential in close proximity or through direct contact (ANSI C63.14 1992).ESS Acronym for Environmental Stress Screening.eV Abbreviation for electron-volt.FF Symbol for Farad, measure of capacitance.f Abbreviation for frequency.FACT Acro
42、nym for Fairchild Advanced Cmos Technology, as in 74FACT245.FAST Acronym for Fairchild Advanced Schottky TTL, as in 74F245.FCT Acronym for Fast Cmos Technology, as in 74FCT245.FDTD Acronym for Finite Difference Time Domain modeling.FEA Acronym for Finite Element Analysis.FEM Acronym for Finite Eleme
43、nt Method. Method of numerical computational electromagnetics. Essentially everybody does some form of this for field solvers, such as T-lines.FET Acronym for Field Effect Transistor.FFT Acronym for Fast Fourier Transform.FOM Acronym for Figure Of Merit.FPGA Acronym for field programmable gate array
44、.functional modelingModeling by the use of mathematical functions, algorithms and formulas.GG Symbol for giga, as in10+12GaAs Acronym for Gallium Arsinide.GB or Gbit or GBIT Acronym for GigaBit.glue logic Small ICs that level shift and otherwise perform simple functions that enable large blocks of l
45、ogic (ASICs, microprocessors, memories) to work together. Thus gluing them together.GND Acronym for GrouND. A reference connection commonly connected to Earth, whose electric potential is usually equal to zero.ground bounce The transient rise or fall in voltage on a ground plane or ground pin from i
46、ts ideal quiescent value of zero due switching currents on and off through impedance (mostly inductance) in the ground path. A similar effect on the power plane causes power bounce. The result is noise on the signal that can decrease signal to noise ratio in analog circuits or lead to false switchin
47、g in digital circuits.GTL Acronym for Gunning Transceiver Logic, as in 74GTL245.GTLP Acronym for Gunning Transceiver Logic Plus, as in 74GTLP245.guard-banding The practice of adding safety margin, or extra safety margin, to specification limits or population distributions.HH Abbreviation for Henry,
48、the unit of inductance.HALT Acronym for Highly Accelerated Life Test.HASS Acronym for Highly Accelerated Stress Screening.HC Acronym for High speed Cmos, as in 74HC245.HCT Acronym for High speed Cmos with TTL thresholds, as in 74HCT245.HDL Acronym Hardware Description Language. One of several specia
49、lized high-level languages used by semiconductor designers to describe the features and functionality of chips and systems prior to handoff to the IC layout process. HDL descriptions are used in both the design implementation and verification flows. Currently, the two standard HDLs in use worldwide are Verilog-HDL and VHDL. Several proprietary HDLs also exist, mainly for describing logic that is targeted for vendor-specific programmable logic devices.high-speed digital designThe design of digital circuits relative to their analog behavior. Particularly, where the fast s
